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SABIC's Specialties Business
ULTEM™ Resin 9085
Polymer Name:
Polyether Imide Alloy
Processing Methods:
3D Printing, Fused Deposition Modeling (FDM), Extrusion, Large Format Additive Manufacturing (LFAM), Injection Molding, Profile Extrusion, Sheet Extrusion, Thermoforming
Density:
1340.0 - 1340.0 kg/m³
Flexural Modulus:
2700.0 - 2700.0 MPa
End Uses:
Aircraft Seat, Laminated Bus Bar, Aerospace Applications, Air Ducts, EV Charging Connectors, Infotainment Systems, Rails, Aircraft Interiors
SABIC's Specialties Business ULTEM™ Resin 9085 is a polyetherimide blend that is specifically formulated for use in aerospace cabin interiors, as well as in rail applications and for FDM printing. It complies with aerospace FAR25.853 and OSU55/55 heat release requirements and has been approved by major aerospace OEMs. With a rail EN45545 R6-HL3 rating, this material offers excellent flow, stiffness, and ductility balance, allowing for thin-walled, lightweight designs. ULTEM™ Resin 9085 is opaque and can be custom colored to meet specific design requirements. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
SABIC's Specialties Business
LNP™ THERMOCOMP™ AM Compound DF004XXAR1
Polymer Name:
Polycarbonate (PC)
Fillers Included:
Glass Fiber
Processing Methods:
3D Printing, Fused Filament Fabrication, Large Format Additive Manufacturing (LFAM)
Density:
1350.0 - 1350.0 kg/m³
SABIC's Specialties Business LNP THERMOCOMP DF004XXAR1 compound is based on Polycarbonate (PC) resin containing 20% glass fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Higher Strength, Higher Temperature Performance and Higher Throughput compared to ABS and PPE, as well as Excellent Ductility and Smooth Surface Finish. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
SABIC's Specialties Business
LNP™ THERMOCOMP™ AM Compound AF004XXAR1
Polymer Name:
Acrylonitrile Butadiene Styrene (ABS)
Fillers Included:
Glass Fiber
Processing Methods:
3D Printing, Thermoforming, Large Format Additive Manufacturing (LFAM)
Density:
1198.0 - 1198.0 kg/m³
SABIC's Specialties Business LNP™ THERMOCOMP™ AM Compound AF004XXAR1 is a top-quality material based on acrylonitrile butadiene styrene (ABS) resin containing 20% glass fiber specifically designed for large format additive manufacturing (LFAM) applications. This grade is easy to process, has low warp, and provides excellent print surface quality, making it an ideal candidate for a broad range of applications and tooling, including thermoforming and vacuum forming. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
SABIC's Specialties Business
LNP™ THERMOCOMP™ AM Compound 6C004XXAR1
Polymer Name:
PC/PBT Alloy
Processing Methods:
3D Printing, Large Format Additive Manufacturing (LFAM), Fused Granulate Fabrication (FGF), Fused Filament Fabrication
Density:
1280.0 - 1280.0 kg/m³
End Uses:
Industrial Parts, Industrial Applications, Automotive Body Panel, 3D Printing Applications
SABIC's Specialties Business LNP™ THERMOCOMP™ 6C004XXAR1 compound is based on Polycarbonate / Polybutylene Terephthalate (PC/PBT) resin containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Improved Chemical Resistance, Lower Warp and Good Surface Finish.
SABIC's Specialties Business
LNP™ THERMOCOMP™ AM Compound ZF004XXAR1
Polymer Name:
PPO/PS Alloy
Processing Methods:
Fused Filament Fabrication, 3D Printing, Large Format Additive Manufacturing (LFAM)
Density:
1220.0 - 1220.0 kg/m³
End Uses:
Industrial Parts, 3D Printing Applications
SABIC's Specialties Business LNP THERMOCOMP ZF004XXAR1 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 20% glass fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Lower Thermal Expansion, Improved Hydrolytic Stability, Higher Strength to Weight Ratio and Higher Temperature Performance vs. ABS. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
SABIC's Specialties Business
LNP™ THERMOCOMP™ AM Compound EC004XXAR1
Polymer Name:
Polyether Imide (PEI)
Additives Included:
Flame Retardant
Fillers Included:
Carbon Fiber
Processing Methods:
Fused Filament Fabrication, Fused Granulate Fabrication (FGF), 3D Printing, Large Format Additive Manufacturing (LFAM)
Density:
1340.0 - 1340.0 kg/m³
SABIC's Specialties Business LNP™ THERMOCOMP™ EC004XXAR1 is a compound based on Polyetherimide (PEI) resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications needing higher stiffness vs glass fiber. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, provide low thermal expansion, high temperature performance, excellent strength-to-weight ratio, high modulus and low creep.
SABIC's Specialties Business
LNP™ THERMOCOMP™ AM Compound DC0041XA51
Polymer Name:
Polycarbonate (PC)
Additives Included:
Flame Retardant
Fillers Included:
Carbon Fiber, Milled Glass Fiber
Processing Methods:
Fused Filament Fabrication, Fused Granulate Fabrication (FGF), 3D Printing, Large Format Additive Manufacturing (LFAM)
Density:
1390.0 - 1390.0 kg/m³
SABIC's Specialties Business LNP™ THERMOCOMP™ DC0041XA51 compound is based on PC Copolymer Resin containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Higher Stiffness vs. glass fiber, Higher Strength, Higher Temperature Performance and Higher Throughput compared to ABS and PPE, as well as Smooth Surface Finish. This halogen-free flame retardant resin is EN45545 R1 HL3 and R27 HL2 compliant and an ideal candidate for train interior applications (category R1). It also meets requirements of NFPA-130a
SABIC's Specialties Business
LNP™ THERMOCOMP™ AM Compound DC004XXA11
Polymer Name:
Polycarbonate (PC)
Fillers Included:
Carbon Fiber
Processing Methods:
Fused Granulate Fabrication (FGF), 3D Printing, Fused Filament Fabrication, Large Format Additive Manufacturing (LFAM)
Density:
1290.0 - 1290.0 kg/m³
SABIC's Specialties Business LNP™ THERMOCOMP™ AM DC004XXA11is a compound based on High Heat PC copolymer resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications, including mid-temperature autoclaving tooling. This compound can offer higher temperature performance than standard PC and avoid some of the processing challenges associated with high temperature materials.
SABIC's Specialties Business
LNP™ THERMOCOMP™ AM Compound DC004XXAR1
Polymer Name:
Polycarbonate (PC)
Fillers Included:
Carbon Fiber
Processing Methods:
3D Printing, Fused Filament Fabrication, Large Format Additive Manufacturing (LFAM)
Density:
1270.0 - 1270.0 kg/m³
SABIC's Specialties Business LNP THERMOCOMP DC004XXAR1 compound is based on Polycarbonate (PC) resin containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Higher Stiffness vs. glass fiber, Higher Strength, Higher Temperature Performance and Higher Throughput compared to ABS and PPE, as well as Excellent Ductility and Smooth Surface Finish.FeaturesCost EffectiveHigh DuctilityHigh Impact ResistanceHigh StiffnessHigh StrengthHigh Temperature StrengthSmooth Surface FinishVery Good Heat ResistanceApplications3D PrintingAdditive Manufacturing This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
SABIC's Specialties Business
LNP™ THERMOCOMP™ AM Compound AC004XXAR1
Polymer Name:
Acrylonitrile Butadiene Styrene (ABS)
Fillers Included:
Carbon Fiber
Processing Methods:
3D Printing, Fused Filament Fabrication, Thermoforming, Large Format Additive Manufacturing (LFAM)
Density:
1140.0 - 1140.0 kg/m³
SABIC's Specialties Business LNP THERMOCOMP AC004XXAR1 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Higher Stiffness vs. glass fiber, Easy Processing, Low warp and Good Print Surface quality, making them a good candidate material for a broad range of applications and tooling, including thermoforming and vacuum-forming.FeaturesCost EffectiveEasier ProcessingGood PrintabilityGood ProcessabilityHigh StiffnessLow WarpageVacuum FormingApplications3D PrintingAdditive Manufacturing This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
SABIC's Specialties Business
LNP™ THERMOCOMP™ AM Compound ZC004XXAR1
Polymer Name:
PPO/PS Alloy
Processing Methods:
3D Printing, Large Format Additive Manufacturing (LFAM), Fused Granulate Fabrication (FGF), Fused Filament Fabrication
Density:
1170.0 - 1170.0 kg/m³
End Uses:
Industrial Parts, Industrial Applications, 3D Printing Applications
SABIC's Specialties Business LNP™ THERMOCOMP™ ZC004XXAR1 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Higher Stiffness vs. glass fiber, Lower Thermal Expansion, Improved Hydrolytic Stability, Higher strength to Weight Ratio, Higher Temperature Performance and improved processing vs. ABS based grades.
SABIC's Specialties Business
LNP™ THERMOCOMP™ AM Compound EF004XXAR1
Polymer Name:
Polyether Imide (PEI)
Additives Included:
Flame Retardant
Fillers Included:
Glass Fiber
Processing Methods:
Fused Filament Fabrication, Fused Granulate Fabrication (FGF), 3D Printing, Large Format Additive Manufacturing (LFAM)
Density:
1430.0 - 1430.0 kg/m³
SABIC's Specialties Business LNP™ THERMOCOMP™ EF004XXAR1 is a compound based on Polyetherimide (PEI) resin containing 20% glass fiber for Large Format Additive manufacturing (LFAM) applications. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, provide low thermal expansion, high temperature performance, excellent strength-to-weight ratio, high modulus and low creep.
Mitsubishi Chemical Group Corporation
SHIKOH™ UT-7792
Compatible Substrates & Surfaces:
Metal
SHIKOH™ UT-7792 is a bio-based urethane acrylate oligomer. (Development product) Its biomass degree is 71% while its mechanical properties are the same as a non-biomass grade UV-3300B, with higher elongation and very soft rubbery elasticity suitable for using UV-curable adhesives for electronics devices. Features Bio-based Soft-elastic, High elongation Suitable for adhesion bond and metalizing undercoat with monomers Non-yellowing Applications Adhesive : UV/ EB/ Thermal-curable adhesive for electronics device, optical use, and automotive use. 3D printer *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
SHIKOH™ UV-3300B
Compatible Substrates & Surfaces:
Metal
SHIKOH™ UV-3300B is UV curable urethane acrylate oligomer with excellent soft-elasticity, and very high elongation. It also shows good mechanical properties even at low temperature. EB and Thermal cure systems are also applicable. Features Soft-elastic, High elongation Suitable for adhesion bond and metalizing undercoat with monomers Good mechanical properties at low temperature Non-yellowing Applications Adhesive : UV/ EB/ Thermal-curable adhesive for electronics device, optical use, and automotive use. 3D printer *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
SHIKOH™ UV-3520TH
Chemical Family:
Urethane Acrylates
CASE Ingredients Features:
Good Elongation, Good Elasticity, Weather Resistance, Improved Tear Strength, Excellent Adhesion, Crack Resistance, Tack-free, Good Toughness, High Tensile Strength, Radiation Curable, Improved Flexibility
SHIKOH™ UV-3520TH is an aliphatic urethane acrylate oligomer with soft elasticity, good toughness and high elongation. It shows unique mechanical properties with various reactive diluents. Features Soft-Elastic type, Good toughness, High elongation Diluted in Tetrahydrofurfuryl Acrylate (THFA) (oligomer/ THFA = 70/30 wt%) Non-solvent (100% hardening ingredient) Unique mechanical properties with various reactive diluents Applications UV/ EB/ Thermal-curable adhesive UV adhesive for electric device use 3D printer, and Inkjet *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
SHIKOH™ UV-3700B
Applications:
Electronics Adhesives, 3D Printing, Consumer Electronics
Product Families:
Photoactive Resins, Oligomers, Other Resins & Binders
Chemical Family:
Urethane Acrylates
End Uses:
3D Printing Applications, Undercoat, Solventless & High Solids Coating
SHIKOH™ UV-3700B is UV curable urethane acrylate oligomer with high elongation and soft rubbery elasticity. It is relatively low viscosity despite its high molecular weight. EB and Thermal cure systems are also applicable. Features Soft elastic type, High elongation High molecular weight but relatively low viscosity Non-solvent (100% hardening ingredient) For UV adhesion with monomers Non-yellowing Applications Adhesive: UV/ EB/ Thermal-curable adhesive for electronics device, optical use and automotive use. 3D printer *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
SABIC's Specialties Business
LNP™ THERMOCOMP™ AM Compound JC004XXAR1
Polymer Name:
Polyethersulfone (PES)
Additives Included:
Flame Retardant
Fillers Included:
Carbon Fiber
Processing Methods:
Fused Filament Fabrication, Fused Granulate Fabrication (FGF), 3D Printing, Large Format Additive Manufacturing (LFAM)
Density:
1430.0 - 1430.0 kg/m³
SABIC's Specialties Business LNP THERMOCOMP AM JC004XXAR1 is a compound based on PESU (Polyethersulfone) resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications needing an inherent FR, reinforcement, and a high heat amorphous solution. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
SABIC's Specialties Business
LNP™ THERMOCOMP™ AM Compound EC004EXAR1
Polymer Name:
Polyether Imide (PEI)
Additives Included:
Flame Retardant
Fillers Included:
Carbon Fiber
Processing Methods:
Fused Filament Fabrication, Fused Granulate Fabrication (FGF), 3D Printing, Large Format Additive Manufacturing (LFAM)
Density:
1340.0 - 1340.0 kg/m³
SABIC's Specialties Business LNP™ THERMOCOMP™ EC004EXAR1 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber designed to provide a Wider Process Window and Easier Flow for Large Format Additive Manufacturing (LFAM) applications needing High heat performance. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, provide Low Thermal Expansion, High Temperature Performance, Excellent Strength-to-Weight Ratio, High Modulus and Low Creep.
SABIC's Specialties Business
LNP™ THERMOCOMP™ AM Compound EZ006EXAR1
Polymer Name:
Polyether Imide (PEI)
Additives Included:
Flame Retardant
Fillers Included:
Glass Fiber, Milled Glass Fiber
Processing Methods:
Fused Filament Fabrication, Fused Granulate Fabrication (FGF), 3D Printing, Large Format Additive Manufacturing (LFAM)
Density:
1510.0 - 1510.0 kg/m³
SABIC's Specialties Business LNP™ THERMOCOMP™ EZ006EXAR1is a compound based on Polyetherimide (PEI) resin containing 30% milled glass fiber for Large Format Additive manufacturing (LFAM) applications requiring better dimensional stability and low thermal expansion. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, offer high temperature performance, excellent strength-to-weight ratio, high modulus and low creep.
MOCOM Compounds
ALCOM® 3D TCE PC 5020 16116
Polymer Name:
Polycarbonate (PC)
Processing Methods:
3D Printing, Fused Deposition Modeling (FDM), Extrusion, Injection Molding, Filament Extrusion
End Uses:
Electrical/Electronic Applications
Density:
1300.0 - 1300.0 kg/m³
MOCOM Compounds ALCOM® 3D TCE PC 5020 16116 is a polycarbonate-based polymer with 20% special filler that has increased thermal conductivity, is antistatic, and is heat stabilized. It is used in the Lighting, electrical and electronic market segment and is applicable for Extrusion of 3D printable FDM filaments for functional components. Processing Injection molding Filament extrusion melt temperature should be 250-270°C, and recommendations for 3D printing depending on printer type are nozzle temperature of 300-320°C, bed temperature of 80-120°C, and print speed of 10-60 mm/s.
Scott Bader
Crestaform® Rapid 2.0 3D printing resin
Processing Methods:
Masked Stereolithography (LCD), Digital Light Processing
End Uses:
Modeling Material, Prototyping, Figurines, Jewelry
Density::
1050.0 - 1070.0 kg/m³
Tensile Strength::
46.0 - 46.0 MPa
Crestaform® Rapid 2.0 3D printing resin is an upgraded general-purpose resin formulation that offers a lightning-fast print speed, high print quality, enhanced color, robust mechanical performance, and increased usability. It is specifically designed for creating high-resolution models, figurines, rapid prototyping, and jewelry.
Scott Bader
Crestaform® Open 3D printing resin
Processing Methods:
Stereolithography, Masked Stereolithography (LCD), 3D Printing, Digital Light Processing
End Uses:
Dental Applications, Prototyping, Jewelry
Density::
1080.0 - 1100.0 kg/m³
Tensile Strength::
69.0 - 69.0 MPa
Crestaform® Open 3D printing resin is a versatile 3D printing resin designed for rapid prototyping and the creation of high-resolution models. It offers a fast and efficient method of fabrication. Compatible with various types of resin 3D printers, such as LCD, SLA, and DLP machines, it is suitable for use with popular brands including Formlabs, Asiga, Anycubic, and Elegoo.
Scott Bader
Crestaform® Rapid 3D printing resin
Processing Methods:
Masked Stereolithography (LCD), 3D Printing, Digital Light Processing
End Uses:
Dental Applications, Prototyping, Jewelry
Density::
1050.0 - 1070.0 kg/m³
Tensile Strength::
53.0 - 53.0 MPa
Crestaform® Rapid 3D printing resin is a high-performance 3D printing resin with superior mechanical performance and excellent reactivity. It can be used in most stereolithography 3D printers and cured by UV light. The level and quality of detail that can be achieved is staggering when using Crestaform® resins to produce your 3D print. The opportunities truly are endless.
Scott Bader
Crestaform® Durable 3D printing resin
Processing Methods:
Masked Stereolithography (LCD), 3D Printing, Digital Light Processing
End Uses:
Dental Applications, Prototyping, Jewelry
Density::
1120.0 - 1130.0 kg/m³
Tensile Strength::
43.0 - 43.0 MPa
Crestaform® Durable 3D printing resin is a high-performance 3D printing resin with superior mechanical performance and excellent reactivity. It is compatible with most stereolithography 3D printers and is cured by UV light. The level and quality of detail that can be achieved is staggering when using Crestaform® resins to produce your 3D print. The opportunities truly are endless.
Scott Bader
Crestaform® Tough 3D printing resin
Processing Methods:
Masked Stereolithography (LCD), 3D Printing, Digital Light Processing
End Uses:
Dental Applications, Prototyping, Jewelry
Density::
1290.0 - 1300.0 kg/m³
Tensile Strength::
64.0 - 64.0 MPa
Crestaform® Tough 3D printing resin is a high-performance 3D printing resin with superior mechanical performance and excellent reactivity. It can be used in most stereolithography 3D printers and cured by UV light. The level and quality of detail that can be achieved is staggering when using Crestaform® resins to produce your 3D print. The opportunities truly are endless.
Scott Bader
Crestaform® Dental Modelling HP 3D printing resin
Processing Methods:
3D Printing, Digital Light Processing
End Uses:
Dental Applications
Density::
1080.0 - 1100.0 kg/m³
Tensile Strength::
69.0 - 69.0 MPa
Crestaform® Dental Modelling HP 3D printing resin is specifically designed for the rapid fabrication of precise fixed and removable dental prosthetic models. It combines remarkable dimensional stability during the scan-to-model process with fast printing speeds. Special attention has been given to achieving excellent surface finish and esthetics in the final parts, ensuring clear definition of margin lines and anatomical details.
Scott Bader
Crestaform® Rapid 8K 3D printing resin
Processing Methods:
Digital Light Processing, Masked Stereolithography (LCD)
End Uses:
Prototyping, Dental Applications, Jewelry
Density::
1050.0 - 1070.0 kg/m³
Tensile Strength::
33.0 - 33.0 MPa
Crestaform® Rapid 8K 3D printing resin is specifically optimized for high reactivity and positive feature build-up. It minimizes the depth of cure, enabling the full potential of next-generation 8K LCD and DLP 3D printers to be unlocked. With this resin, intricate details can be created with precision.
Helios Resins
HELIORES 3D Rapid 10
Processing Methods:
Digital Light Processing, Stereolithography, 3D Printing
End Uses:
Modeling Material, Dental Applications, Prototyping
Tensile Strength:
30.0 - 30.0 MPa
HELIORES 3D Rapid 10 is a photopolymer for UV 3D printing designed for use on various types of SLA and DLP printers. The Rapid 10 is a general purpose prototyping material with ABS and PP-like properties. With its high reactivity and excellent precision, the Rapid 10 saves time and produces elements with exceptional details.Features & BenefitsHigh reactivityHigh level of precision and accuracyReduced operational costs
Nexa3D
Nexa3D xPP405-Clear
Processing Methods:
3D Printing, Digital Light Processing
End Uses:
Molds/Dies/Tools, Housings, Power/Other Tools, Consumer Applications
Density:
1050.0 - 1050.0 kg/m³
Tensile Strength:
27.0 - 33.0 MPa
Nexa3D xPP405-Clear is a high elongation and high toughness material with outstanding impact resistance and excellent surface finish. This stiff and durable high performance material is ideal for a wide variety of tools in the production floor, including manufacturing aids and final parts such as housings and consumer goods applications. The unique set of performance attributes makes it comparable to an unfilled thermoplastic like polypropylene. Parts can be printed with various DLP printers and machined, tapped, or polished for final finish.
Nexa3D
Nexa3D xFLEX475-White
Processing Methods:
3D Printing
End Uses:
Gaskets, Sporting Goods, Prototyping, Manifolds, Grips, Pipes, Footwear, Seals, Handles
Density:
1020.0 - 1020.0 kg/m³
Tensile Strength:
3.0 - 4.6 MPa
Nexa3D xFLEX475 White is an industrial strength UV resin that cures to a soft, elastomeric material.xFLEX475 is suitable for applications where resilience, snap back, and tear resistance is desired,such as lattice structures and functional prototyping. This single component resin is easy toprint, making it a superior material for elastomeric applications.
Nexa3D
Nexa3D 3843-xABS Black
Polymer Name:
Acrylonitrile Butadiene Styrene (ABS)
Processing Methods:
3D Printing
End Uses:
Modeling Material, Jigs, Prototyping, Fixtures
Density:
1100.0 - 1100.0 kg/m³
Tensile Strength:
31.0 - 33.0 MPa
Nexa3D 3843-xABS Black is a high performance, high modulus product which boasts excellent flexural and tensile physical properties with a relatively high degree of elongation. Nexa3D 3843-xABS Black displays high green strength and good Heat DeflectionTemperature enabling it to print accurately and function in a wide variety of applications. Nexa3D3843-xABS Black has been tested in QUV exterior weathering conditions (ASTM G-154) for 800 hours with less than a 15% change in Tensile and IZOD Impact properties.
Liqcreate
Liqcreate Flexible-X
Processing Methods:
Stereolithography, 3D Printing, Digital Light Processing
End Uses:
LCD Applications, Industrial Applications, Consumer Applications, Soft Touch Applications, Masked Stereolithography (MSLA)
Density:
1180.0 - 1180.0 kg/m³
Tensile Strength:
2.4 - 2.4 MPa
Liqcreate Flexible-X is an opaque black photopolymer resin for open MSLA, DLP, and laser-based 3D printers. 3D-printed parts from this material have exceptional flexibility and great rebound properties.Liqcreate Flexible-X is compatible with open DLP, LCD, MSLA, and SLA 3D printers in the range of 385 - 420nm. Its low hardness of 55 Shore A and elongation of up to 160% makes it perfect for the manufacturing of soft touch and elastic parts for industrial use.
Liqcreate
Liqcreate Composite-X
Processing Methods:
Stereolithography, 3D Printing, Digital Light Processing
End Uses:
LCD Applications, Dental Applications, Industrial Applications, Consumer Applications, Automotive Components, Tooling, Masked Stereolithography (MSLA)
Density:
1520.0 - 1520.0 kg/m³
Liqcreate Composite-X is an extremely rigid and high-performance reinforced nano-micro composite resin for SLA, DLP & LCD/MSLA in the range of 385 - 420nm. Perfect for rapid tooling, wind tunnel testing, and industrial applications.Liqcreate Composite-X is one of the stiffest and strongest material available in the market. It has a flexural modulus of over 9000 MPa and flexural strength of 150 - 170 MPa. The material can be used after UV-post curing, or the properties can be boosted with a thermal cure. This material has features like excellent chemical resistance, high strength, and high stiffness.
Liqcreate
Liqcreate Clear Impact
Processing Methods:
Stereolithography, Digital Light Processing, 3D Printing
End Uses:
Consumer Applications, Industrial Applications
Density:
1120.0 - 1120.0 kg/m³
Liqcreate Clear Impact is an optically clear photopolymer resin for SLA, DLP, and MSLA technologies in the range of 385 - 405nm. Parts created with Liqcreate Clear Impact are perfectly transparent after post-processing, slightly flexible, and have excellent impact resistance.The high toughness of this clear resin makes it ideal for the production of clear and transparent functional parts which are repeatedly exposed to stress. Low water absorption, weather resistance, and low yellowing properties makes it perfect for outdoor and display applications.
Liqcreate
Liqcreate Premium Flex
Processing Methods:
Stereolithography, 3D Printing, Digital Light Processing
End Uses:
LCD Applications, Prototyping, Soft Touch Applications, Masked Stereolithography (MSLA)
Density:
1180.0 - 1180.0 kg/m³
Tensile Strength:
1.7 - 1.7 MPa
Liqcreate Premium Flex is a translucent turquoise blue photopolymer resin with great processability and print speed on MSLA and DLP-based 3D printers. 3D-printed parts from this material have exceptional flexibility and low surface hardness of 63 Shore A.Liqcreate Premium Flex is easy to use on open DLP and LCD/MSLA 3D printers in the range of 385 - 420nm. Its high elongation and low Shore A hardness makes it perfect for a diversity of soft touch and elastic prototypes.
Liqcreate
Liqcreate Strong-X
Processing Methods:
Stereolithography, Injection Molding, Digital Light Processing, 3D Printing
Density:
1120.0 - 1120.0 kg/m³
Liqcreate Strong-X is one of the strongest photopolymer resins available in the market. Its flexural strength of 135MPa is comparable to the industry’s leading dual-cure cyanate ester resins.Liqcreate Strong-X is easy to use on open SLA, MSLA, and DLP 3D-printers in the range of 385 - 405nm and only requires UV post-curing. This material has excellent features like high strength, high stiffness, and high-temperature resistance which makes it ideal for injection molding and heavy-duty applications.
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