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AI Technology ME 7155

ME7155 is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits not only outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper), but also exhibits high level of uniformity and consistency in appearance and smoothness of texture, yielding potential ease of use and success in applications. The high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components. MEZ155 can be readily reworked at 80-1502.

Product Type: Epoxy Adhesive

Application Area: Die/Chip Attach

Cure Method: Heat Cure

Compatible Substrates & Surfaces: Aluminum, Copper, Metal

Application Method: Injection

Technical Data Sheet
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Identification & Functionality

Product Type

Features & Benefits

Product Features
  • Stress free.
  • Solvent free.
  • Thermally conductive.
  • Reworkable.
  • Epoxy paste adhesive.
  • High power die attach.
  • Substrate and component.
  • Reworkability.
  • Mismatched CTE's.

Applications & Uses

Application Area
Application Method
Compatible Substrates & Surfaces
Cure Method
Application Procedures
  • Remove from freezer in original sealed package.
  • Thaw for 30 to 60 minutes at 25°C before using.
  • Dispense adhesive onto clean substrate.
  • Cure according to one of the recommended cure schedules.

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Electrical Resistivity (at 150°C, 60minutes)min. 1x10¹⁴Ω-cm
Dielectric Strengthmin. 750Volts/mil
Glass Transition Temperature- 27.5 to -22.5°C
Glass Transition Temperature-25°C
Lap Shear Strengthmin. 6.9N/mm²
Device Push Off Strengthmin. 12.4N/mm²
Hardness72 - 88Shore A
Cured Density2.07 - 2.53g/cc
Thermal Conductivity1.53 - 1.87W/m-°C
Thermal Conductivitymin. 1.7W/m-°C
Coefficeint of Linear Thermal Expansion102 - 138ppm/°C
Maximum Continuous Operation Temperaturemax. 150°C
Average Viscosity (at 25°C, 0.5rpm, Spindle CP51)220000 - 330000cPsBrookfield Viscometer DV-1
Pot Life (at 25°C)5Days
Electrical Resistivitymin. 1x10¹⁴Ω-cm
Die Shear Strengthmin. 1800psi
Viscosity (at 0.5 rpm)276000cPs
Viscosity (at 0.5 rpm)275000cPs

Regulatory & Compliance

Certifications & Compliance
Regulatory Information
  •  Meets Mil-Std 883.
  • Method 5011.5 and NASA-ESA outgassing requirements.
Note

4 Hour 125°C or 150°C vacuum or air flow oven post bake is required to meet outgassing requirements.

Technical Details & Test Data

Cure Schedules
Temperature Time
80°C 8 hrs
100°C 4 hrs
125°C 2 hrs
150°C 1 hr

 

Packaging & Availability

Product Availability

ME7155 is available in syringes for automatic needle dispense applications or in jars.

Storage & Handling

Shelf Life
1 Year (at -40°C)
Storage Information
  • Storage temperature: -40°C .
  • Pot life 5 Days at 25°C.