Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Product Features
- Stress-free, very high.
- Thermally conductive.
- Reworkable.
- Epoxy paste adhesive.
- High power die attach.
- Substrate and component attach.
- Reworkability.Mismatched CTE's.
Applications & Uses
- Applications
- Application Area
- Application Method
- Cure Method
- Application Procedures
- Thaw for 30 minutes before using syringe or opening jar.
- Dispense adhesive onto clean substrate.
- Pre-bake dispensed adhesive open-face at 60°C for 30 to 60 minutes or 80°C for 30 minutes to achieve optimum bonding.**
- Cure according to one of the recommended cure schedules.
- Note
**For higher temperature curing, above 125°C andlor bonding area of over 1cm x 1cm, it is recommended that the dispensed adhesive be pre-baked, open- face without parts, at 60°C for 60 minutes or 80°C for 30 minutes, before parts are mounted and cured.
Properties
- Physical Form
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Electrical Resistivity (at 150°C, 60minutes) | min. 1x10¹⁴ | Ω-cm | — |
| Dielectric Strength | min. 750 | Volts/mil | — |
| Glass Transition Temperature | - 27.5 to -22.5 | °C | — |
| Glass Transition Temperature | -25 | °C | — |
| Lap Shear Strength | min. 6.9 | N/mm² | — |
| Device Push Off Strength | min. 12.4 | N/mm² | — |
| Hardness | 80 - 100 | Shore A | — |
| Hardness | 33 - 63 | Shore D | — |
| Cured Density | 2.07 - 2.53 | g/cc | — |
| Thermal Conductivity | min. 3.6 | W/m-°C | — |
| Thermal Conductivity | 3.24 - 3.96 | W/m-°C | — |
| Coefficeint of Linear Thermal Expansion | 102 - 138 | ppm/°C | — |
| Maximum Continuous Operation Temperature | max. 150 | °C | — |
| Average Viscosity (at 25°C, 0.5rpm, Spindle CP51) | 200000 - 300000 | cPs | Brookfield Viscometer DV-1 |
| Pot Life (at 25°C) | 72 | hours | — |
| Electrical Resistivity | min. 1x10¹⁴ | Ω-cm | — |
| Die Shear Strength | min. 1800 | psi | — |
| Viscosity (at 0.5 rpm) | 250000 | cPs | — |
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Cure Schedules
Temperature Time 80°C 8 hrs 100°C 4 hrs 125°C 2 hrs 150°C 1 hr
Packaging & Availability
- Product Availability
MET158 Is available in syringes for automatic needle dispense applications or in jars.
Storage & Handling
- Shelf Life
- 1 Year (at -40°C)
- Storage Information
- Storage temperature: -40°C in sealed package.
- Pot life 72 hrs at 25°C