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AI Technology ME 7159

ME7159 is a reworkable, diamond filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The ultra high thermal conductivity of this diamond filled material makes it useful for bonding high-powered, large area die and components. It can be readily reworked at 80-100°C.

Product Type: Epoxy Adhesive

Application Area: Die/Chip Attach

Cure Method: Heat Cure

Compatible Substrates & Surfaces: Aluminum, Copper, Metal

Application Method: Injection

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Product Type

Features & Benefits

Product Features
  • Stress-free, ultra high.
  • Thermally conductive.
  • Reworkable.
  • Epoxy paste adhesive.
  • High power die attach.
  • Substrate and component.
  • Reworkability.
  • Mismatched CTE's.
Cure Schedules
Temperature Time
80°C 8 hrs
100°C 4 hrs
125°C 2 hrs
150°C 1 hr

Applications & Uses

Application Area
Application Method
Compatible Substrates & Surfaces
Cure Method
Application Procedures
  • Thaw at ambient for 30 minutes before using.
  • Dispense adhesive onto clean substrate.
  • Pre-bake adhesive at 60°C from 30 to 60 minutes or 80°C for 30 minutes to achieve optimum bonding. Pre-bake not needed in all applications.**
  • Cure according to one of the recommended schedules.
Note

* For higher temperature curing. above 125°C and/or bonding area of over 1cmx 1cm, it is recommended that the dispensed adhesive be pre-baked, open-faced without parts at 60°C for 60 to 120 minutes or 80°C for 45-90 minutes before parts are mounted and cured.

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Electrical Resistivity (at 150°C, 60minutes)min. 1x10¹⁴Ω-cm
Dielectric Strengthmin. 750Volts/mil
Glass Transition Temperature- 27.5 to -22.5°C
Glass Transition Temperature-25°C
Lap Shear Strengthmin. 6.9N/mm²
Device Push Off Strengthmin. 12.4N/mm²
Hardness80 - 100Shore A
Hardness33 - 63Shore D
Cured Density2.07 - 2.53g/cc
Thermal Conductivity10.26 - 12.54W/m-°C
Thermal Conductivitymin. 11.4W/m-°C
Coefficeint of Linear Thermal Expansion102 - 138ppm/°C
Maximum Continuous Operation Temperaturemax. 150°C
Average Viscosity (at 25°C, 0.5rpm, Spindle CP51)236000 - 354000cPsBrookfield Viscometer DV-1
Pot Life (at 25°C)5Days
Electrical Resistivitymin. 1x10¹⁴Ω-cm
Die Shear Strengthmin. 1800psi
Viscosity (at 0.5 rpm)310000cPs

Regulatory & Compliance

Certifications & Compliance

Storage & Handling

Shelf Life
1 Year (at -40°C)
Storage Information
  • Storage temperature: -40°C .
  • Pot life 5 Days at 25°C.