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AI Technology ME 7656

ME7656 is a reworkable, boron-nitride crystallite filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The very high thermal conductivity of this material makes it useful for bonding high- powered, large area die and components.

Product Type: Epoxy Adhesive

Application Area: Die/Chip Attach, Power Modules

Cure Method: Heat Cure

Compatible Substrates & Surfaces: Aluminum, Copper, Metal

Application Method: Injection

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Product Type

Features & Benefits

Product Features
  • Stress free, very high.
  • Thermal conductivity.
  • Fast curing epoxy paste.
  • Insulating.
  • Reworkable.
  • High power die-attach.
  • Power module substrate attach.
  • High power component attach.

Applications & Uses

Application Method
Compatible Substrates & Surfaces
Cure Method
Application Procedures
  • Thaw for 30 minutes before opening jar.
  • Dispense adhesive onto clean substrate.
  • Adhesive dots should be in cross-hatched pattern for large area bonding.
  • Cure according to one of the recommended schedules.

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Electrical Resistivity (at 150°C, 30minutes)min. 1x10¹⁴Ω-cm
Dielectric Strengthmin. 750Volts/mil
Glass Transition Temperature-11 to -9°C
Glass Transition Temperature-10°C
Device Push Off Strengthmin. 8.3N/mm²
Hardness72 - 88Shore A
Cured Density2.07 - 2.53g/cc
Thermal Conductivitymin. 3.6W/m-°C
Thermal Conductivity3.24 - 3.96W/m-°C
Coefficeint of Linear Thermal Expansion102 - 138ppm/°C
Maximum Continuous Operation Temperaturemax. 150°C
Average Viscosity (at 25°C, 0.5rpm, Spindle CP51)160000 - 240000cPsBrookfield Viscometer DV-1
Electrical Resistivitymin. 1x10¹⁴Ω-cm
Die Shear Strengthmin. 1200psi
Viscosity (at 0.5 rpm)200000cPs

Regulatory & Compliance

Certifications & Compliance

Technical Details & Test Data

Cure Schedules
Temperature Time
80°C 8 hrs
100°C 4 hrs
125°C 2 hrs
150°C 1 hr

 

Packaging & Availability

Product Availability

ME7656 is available in syringes for automatic needle dispense applications or in in jars.

Storage & Handling

Shelf Life
1 Year
Storage Information

Storage temperature: -40 °C.