Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Product Features
- Stress free, very high.
- Thermal conductivity.
- Fast curing epoxy paste.
- Insulating.
- Reworkable.
- High power die-attach.
- Power module substrate attach.
- High power component attach.
Applications & Uses
- Applications
- Application Area
- Application Method
- Cure Method
- Application Procedures
- Thaw for 30 minutes before opening jar.
- Dispense adhesive onto clean substrate.
- Adhesive dots should be in cross-hatched pattern for large area bonding.
- Cure according to one of the recommended schedules.
Properties
- Physical Form
- Typical Properties
Value | Units | Test Method / Conditions | |
Electrical Resistivity (at 150°C, 30minutes) | min. 1x10¹⁴ | Ω-cm | — |
Dielectric Strength | min. 750 | Volts/mil | — |
Glass Transition Temperature | -11 to -9 | °C | — |
Glass Transition Temperature | -10 | °C | — |
Device Push Off Strength | min. 8.3 | N/mm² | — |
Hardness | 72 - 88 | Shore A | — |
Cured Density | 2.07 - 2.53 | g/cc | — |
Thermal Conductivity | min. 3.6 | W/m-°C | — |
Thermal Conductivity | 3.24 - 3.96 | W/m-°C | — |
Coefficeint of Linear Thermal Expansion | 102 - 138 | ppm/°C | — |
Maximum Continuous Operation Temperature | max. 150 | °C | — |
Average Viscosity (at 25°C, 0.5rpm, Spindle CP51) | 160000 - 240000 | cPs | Brookfield Viscometer DV-1 |
Electrical Resistivity | min. 1x10¹⁴ | Ω-cm | — |
Die Shear Strength | min. 1200 | psi | — |
Viscosity (at 0.5 rpm) | 200000 | cPs | — |
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Cure Schedules
Temperature Time 80°C 8 hrs 100°C 4 hrs 125°C 2 hrs 150°C 1 hr
Packaging & Availability
- Product Availability
ME7656 is available in syringes for automatic needle dispense applications or in in jars.
Storage & Handling
- Shelf Life
- 1 Year
- Storage Information
Storage temperature: -40 °C.