- Applications:Semiconductor Manufacturing, Appliances & Electronics, Adhesives & Sealants
- Product Families:Conductive Adhesives, Adhesives & Sealants
- Chemical Family:Epoxy & Epoxy Derivatives
ME8412 is a silver filled, solvent free, electrically and thermally conductive paste. It is designed for automated, online, die attach processing. It is thixotropic and will not sag on vertical surfaces. Designed to meet the hybrid adhesive specification, Mil Std 883; Method 5011.4 in terms of ionic impurities, ME8412 exhibits low outgassing at 125C and passes NASA outgassing requirements.