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AI Technology ME 7857-SC

ME7857-SC is a medium viscosity, silicon carbide filled, flexible epoxy for snap curing application. It is a reworkable, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility down to -60°C. Ideal for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The stress-free flexible adhesive maintains good stable bond strength of 100 psi from 150-250°C and has outstanding thermal stability.

Product Type: Epoxy Adhesive

Application Area: Die/Chip Attach, Heat Sink, Power Modules

Cure Method: Heat Cure

Compatible Substrates & Surfaces: Aluminum, Copper, Metal

Application Method: Injection

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Product Type

Features & Benefits

Labeling Claims
Product Features
  • High thermal conductivity.
  • Solvent free,thixotropic.
  • Electrically insulating.
  • Epoxy paste adhesive.
  • 20 ppm ionic impurities.
  • Large area die attach.
  • Component attach including SMT.
  • Heatsink and substrate attach.
  • Sealing.
  • Power module bonding.

Applications & Uses

Application Method
Compatible Substrates & Surfaces
Cure Method
Application Procedures
  • Thaw for 30 minutes before opening jar.
  • Dispense adhesive onto clean substrate.
  • Cure according to one of the recommended schedules.

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Electrical Resistivity (at 150°C, 30minutes)min. 1x10¹³Ω-cm
Dielectric Strengthmin. 750Volts/mil
Glass Transition Temperature-54 to -66°C
Glass Transition Temperature-60°C
Lap Shear Strengthmin. 6.9N/mm²
Device Push Off Strengthmin. 10.3N/mm²
Hardness72 - 88Shore D
Cured Density2.07 - 2.53g/cc
Thermal Conductivity2.61 - 3.19W/m-°C
Thermal Conductivitymin. 2.9W/m-°C
Coefficeint of Linear Thermal Expansion85 - 115ppm/°C
Maximum Continuous Operation Temperaturemax. 150°C
Pot Life (at 25°C)24hours
Viscosity (at 24°C, 5rpm, Thixotropic Index=∼2.5)48000 - 72000cPs
Electrical Resistivitymin. 1x10¹³Ω-cm
Die Shear Strengthmin. 1500psi
Die Shear Strengthmin. 1200psi
Viscosity (at 5 rpm)60000cPs

Regulatory & Compliance

Certifications & Compliance

Technical Details & Test Data

Cure Schedules
Temperature Time
80°C 4 hrs
100°C 2 hrs
125°C 1 hr
150°C 30 mins

Packaging & Availability

Product Availability

ME7857-SC is available in syringes for automatic needle dispense applications or in jars.

Storage & Handling

Shelf Life
1 Year (at -40°C)
Storage Information

Storage temperature: -40 °C in original package.