- Product Type:Solvent free (100% Solids) Sealant, Potting Compound, 2K (2 component) Sealant
- Application Area:Electrical Components
- Cure Method:Heat Cure
- Chemical Family:Silicones
PAKCOOL® TPC-213 is 1:1 two-component liquid electronic potting material, which can be solidified at room temperature or heated change. In addition to high thermal conductivity, this product also has a low thermal expansion rate and high insulation characteristics, so as to more effectively eliminate electronic components destructive effects due to changes in operating temperature.