Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Product Features
Flexible epoxy adhesive.
High thermal conductivity.
2 component, premixed frozen.
Stress free bonding and reworkable.
High power die and component attach.
Substrate attach.
Heatsink attach.
Large area bonding.
Bonding Adherends with Mismatched CTE's.
Applications & Uses
- Applications
- Application Area
- Application Method
- Cure Method
- Application Procedures
- Store Part A and Part B at ambient. Part A has higher vicosity.
- Mix A and B 1:1 by weight.
- Cure according to one of the recommended cure schedules.
Properties
- Physical Form
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Electrical Resistivity (at 150°C, 60minutes) | min. 1x10¹⁴ | Ω-cm | — |
| Dielectric Strength | min. 750 | Volts/mil | — |
| Glass Transition Temperature | - 27.5 to -22.5 | °C | — |
| Glass Transition Temperature | -25 | °C | — |
| Lap Shear Strength | min. 6.9 | N/mm² | — |
| Device Push Off Strength | min. 12.4 | N/mm² | — |
| Cured Density | 2.07 - 2.53 | g/cc | — |
| Thermal Conductivity | 3.24 - 3.96 | W/m-°C | — |
| Thermal Conductivity | min. 3.67 | W/m-°C | — |
| Coefficeint of Linear Thermal Expansion | 120 | ppm/°C | — |
| Maximum Continuous Operation Temperature | max. 150 | °C | — |
| Average Viscosity (at 25°C, 0.5rpm, Spindle CP51) | 232000 - 348000 | cPs | Brookfield Viscometer DV-1 |
| Electrical Resistivity | min. 1x10¹⁴ | Ω-cm | — |
| Die Shear Strength | min. 1800 | psi | — |
| Viscosity (at 0.5 rpm) | 337000 | cPs | — |
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Cure Schedules
Temperature Time 80°C 8 hrs 100°C 4 hrs 125°C 2 hrs 150°C 1 hr For tack and cure: Tack the die with DAF with heated collet and heated stage holding the header, leadframe, module or substrate at 100-150°C. Post curing at the same temperature
The die or component can also be tacked on the substrate at 100°C or higher with 5 psi. When a filet around the edge of the die or component is observed, the pressure can be released for the rest of the bonding cycle.
Packaging & Availability
- Product Availability
EG7658 is available in syringes for automatic needle dispense applications or in jars. Upon request, the material can be shipped premixed and frozen.
Storage & Handling
- Shelf Life
- 1 Year
- Storage Information
Storage temperature: 25°C.