- Applications:Semiconductor Manufacturing, Adhesives & Sealants, Appliances & Electronics
- Product Families:Conductive Adhesives, Adhesives & Sealants
ME7159 is a reworkable, diamond filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The ultra high thermal conductivity of this diamond filled material makes it useful for bonding high-powered, large area die and components. It can be readily reworked at 80-100°C.