Products

Cast-Coat Inc. CC3-450 is a medium viscosity, aluminum filled, bonding resin that has gained wide-spread acceptance as the primary bonding resin used in the assembly of heat sink components and the attachment of heat sinks to sources of heat or cold. This resin system is the most widely used bonding agent in the heat sink industry with a history of many varied applications over the last thirty years. There is real industry acceptance for this product at all of the major heat sink suppliers for their bonded heat sink requirements.

Cast-Coat Inc. CC3-402A-1 is a general purpose, fire retardant epoxy potting resin exhibiting low abrasion resistance. It is designed to be used where low viscosity and good wetting-out properties are important. Low shrinkage and good thermal shock resistance minimize stress on potted components. A choice of hardeners enable the CC3-402A-1 to be cured either at room temperature or with heat. Even though the entire CC3-402A-1 series offers a low percent of filler separation, it is advisable to always mix the contents in the shipping container prior to use.

Cast-Coat Inc. CC3-301ADFR is a fire retardant version of CC3-301AD. It offers the same excellent heat transfer, high voltage insulation and dimensional stability over a wide temperature range. As an encapsulant for power devices, it distributes heat evenly throughout the casting, providing greater efficiency and a longer working life. This compound has good wetting properties and low surface tension. It’s high fluidity and good air release recommend it for potting intricate circuitry. Glass diodes potted in CC3-301AD-FR have shown good resistance to cracking under severe temperature cycling. The filler used in CC3-301AD-FR may settle out during storage. It is very important to stir the material in it’s shipping container prior to use.

Cast-Coat Inc. CC3-208 Clear is a general purpose transparent epoxy coating which can be easily applied by brush, dip or spray. It offers high resistance to water and chemical attack. For continuous high heat or corrosive chemical exposure, Ancamine Z curing agent is recommended, but for most applications requiring room temperature cure, H-1 Hardener is ideal. Build up of 2 – 5 mils is typical for single applications. Multiple applications can be achieved without loss of adhesion between coats. CC3-208 contains solvents which evaporate during cure.

Cast-Coat Inc. CC3-465 was developed for the semiconductor industry as a light weight, low dielectric constant epoxy potting compound. Its low viscosity and good wetting properties enable densely packaged circuitry to be totally encapsulated, void free without the aid of a vacuum in most cases. The hollow glass microspheres increase its structural strength and electrical insulation while reducing shrinkage and thermal conductivity. CC3-465 is easy to use and is readily adaptable to automatic machine dispensing. It cures at room temperature or with heat and meets most military and UL flame retardant requirements.

Cast-Coat Inc. CC3-300 is a high viscosity, alumina filled casting resin offering high thermal conductivity, high heat distortion, excellent electrical insulation, low coefficient of thermal expansion and extremely low shrinkage during cure. It will withstand the most rugged tests of temperature, chemical attack and voltage shock, and is easier to fabricate than metals or ceramics at a lower cost. Supplied as a pourable resin, it cures to a rigid, opaque plastic at room temperature or with heat. The thermal coefficient of expansion is closely matched to aluminum. CC3-300 has excellent adhesion to a wide variety of materials, i.e., metal, plastic, glass, ceramic. To reduce viscosity, warm the resin between 100°F to 150°F prior to adding the hardener.

Cast-Coat Inc. CC3-301AD is a low viscosity version of CC3-301. It offers the same excellent heat transfer, high voltage insulation and dimensional stability over a wide temperature range. As an encapsulant for power devices, it distributes heat evenly throughout the casting, providing greater efficiency and a longer working life. This compound has good wetting properties and low surface tension. It’s high fluidity and good air release recommend it for potting intricate circuitry. Glass diodes potted in CC3-301AD have shown good resistance to cracking under severe temperature cycling. Unlike CC3-301, the filler used in CC3-301AD may settle out during storage. It is very important to stir the material in it’s shipping container prior to use.

Cast-Coat Inc. CC3-341 was developed as a thin glue line adhesive to be used in bonding high wattage semiconductor mounting blocks to heatsinks. Being thermally conductive and electrically insulating, CC3-341 exhibits the unique capability of providing an excellent heat path between a power device and heatsink while insuring maximum electrical isolation. Glue lines as thin as 0.001” can be easily achieved while still maintaining a strong bond over a wide temperature range of -65°C to 155°C. When cured, CC3-341 is not adversely affected by moisture, humidity or salt spray, and will withstand repeated cycling through a wave solder machine.

Cast-Coat Inc. CC3-402A is a general purpose, fire retardant epoxy potting resin exhibiting low abrasion resistance. It is designed to be used where low viscosity and good wetting-out properties are important. Low shrinkage and good thermal shock resistance minimize stress on potted components. A choice of hardeners enable the CC3-402A to be cured either at room temperature or with heat. Even though the entire CC3-402A series offers a low percent of filler separation, it is advisable to always mix the contents in the shipping container prior to use.

Cast-Coat Inc. CC3-402 is a general purpose, mineral filled epoxy potting resin exhibiting low abrasion resistance. It is designed to be used where low viscosity and good wetting-out properties are important. Low shrinkage and good thermal shock resistance minimize stress on potted components. A choice of hardeners enable the CC3-402 to be cured either at room temperature or with heat. Even though the entire CC3-402 series offers a low percent of filler separation, it is advisable to always mix the contents in the shipping container prior to use.

Cast-Coat Inc. CC3-343 is a unique dielectric coating that offers excellent heat transfer while providing exceptionally high electrical isolation. It is resistive to most chemicals for short time exposure. It is recommended for coating printed circuit boards and especially heatsink assemblies. The coating effectively distributes heat throughout the entire coated surface and can be easily applied using conventional spray equipment. Thicknesses ranging from 1 to 6 mils can be applied in one coat. However, multiple coats are recommended when thickness of 5 mils or more are needed. CC3-343 is opaque so it offers excellent hiding power, cures dimple free and provides excellent edge coverage.

Cast-Coat Inc. CC3-100 exhibits a wide variety of excellent features found only in the highest quality epoxy resins. It is a medium viscosity, unfilled, resilient, transparent epoxy which can be cured at room temperature or with heat.

Cast-Coat Inc. CC3-301AD-FR Flex-12 is a fire retardant version of CC3-301AD. It offers the same excellent heat transfer, high voltage insulation and dimensional stability over a wide temperature range. As an encapsulant for power devices, it distributes heat evenly throughout the casting, providing greater efficiency and a longer working life. This compound has good wetting properties and low surface tension. It’s high fluidity and good air release recommend it for potting intricate circuitry. Glass diodes potted in CC3-301AD-FR Flex-12 have shown good resistance to cracking under severe temperature cycling. The filler used in CC3-301AD-FR Flex-12 may settle out during storage. It is very important to stir the material in it’s shipping container prior to use.

Cast-Coat Inc. CC3-105 exhibits a wide variety of excellent features found only in the highest quality epoxy resins. It is a low viscosity, unfilled, resilient, transparent epoxy which can be cured at room temperature or with heat.