Products

DAP D72/6120F is a versatile diiallyl ortho-phthalate molding compound, filled with short glass fibers and featuring flame retardant properties. Supplied in a free-flowing granular form, this compound is well-suited for a variety of molding applications. It can be easily molded using compression, transfer, or injection equipment and can be preformed with ease. An important distinction is that it has passed NASA outgassing tests, indicating its suitability for applications with stringent outgassing requirements, particularly in industries like aerospace where such standards are critical.

Cosmic Epoxy E4920 is a mineral-filled epoxy molding compound available either in granular form or preformed in various sizes and weights. It features excellent moisture resistance, thermal cycling stability, and remarkable moldability. Furthermore, parts molded from this material do not support fungus growth, and it is specifically designed for the encapsulation of passive devices, including capacitors, inductors, diodes, and rectifiers.

Cosmic Epoxy E484-FDA is a mineral-filled, glass-reinforced, electrical-grade epoxy molding compound supplied in granular form. It has received approval for direct food contact. Notably, it possesses outstanding mechanical strength and electrical properties, especially at high temperatures, and has met the rigorous NASA outgassing standards. This material is used in electrical hardware applications such as underwater connectors and other insulation needs.

DAP K77/6220F is a high-quality diallyl iso-phthalate molding compound that combines short glass fibers and flame retardant properties. Supplied in granular form, it is designed for ease of use in molding applications. This compound has excellent flow characteristics, making it easy to pour and mold in standard compression, transfer, or injection equipment. Its flame retardant properties make it suitable for applications where fire resistance is a critical factor, such as in the production of components for fire safety equipment or other high-temperature environments.

DAP K31/6220 is a versatile diallyl iso-phthalate molding compound, filled with short glass fibers and supplied in granular form. This compound offers excellent heat resistance and is suitable for a wide range of applications. It is easy to work with, pouring easily and allowing for preforming. Additionally, it molds readily using standard compression, transfer, or injection equipment. One notable feature of K31/6220 is its FDA approval for direct food contact use, making it a reliable choice for applications in the food industry where heat resistance and safety standards are essential.

DAP D33/6120 is a versatile general purpose diallyl ortho-phthalate molding compound that incorporates short glass fibers for added strength. Supplied in a free-flowing granular form, it is designed for ease of use in molding applications. This compound can be easily molded using compression, transfer, or injection equipment, and it can also be readily preformed to suit the specific requirements of the application. Its blend of properties makes it suitable for a range of molding applications where strength and versatility are essential.

Farboset® 2472V0 is a novolac epoxy molding compound that is mineral-filled for enhanced performance. It offers rapid cure rates, excellent moldability, and exceptional resistance to thermal shock and moisture. This compound has been specially formulated to provide improved resistance to moisture ingress, making it an ideal choice for applications where exposure to moisture is a concern. Additionally, it features a high glass transition temperature, ensuring optimum reliability in performance. Its combination of properties makes it well-suited for a range of applications where resilience to environmental conditions is crucial.

Cosmic Epoxy C102 is a copper-filled molding compound available in a very fine granular form. It is suitable for various molding processes, including injection molding, compression molding, and transfer molding. This material is designed for fabricating parts that demand high strength and excellent electrical conductivity.

Cosmic Epoxy E484 is a mineral-filled, glass-reinforced, electrical-grade epoxy molding compound supplied in granular form. It boasts excellent mechanical strength and electrical properties, particularly at high temperatures, and has successfully passed NASA outgassing tests. This compound finds applications in electrical hardware, including underwater connectors and various insulation needs.

Farboset® 2220 is a granular, mineral-filled, novolac epoxy molding compound known for its excellent moldability, fast cure rate, and strong physical and electrical properties. It is specially designed for high-performance applications that demand enhanced thermal characteristics. These applications include the encapsulation of bushings, insulators, and various electrical and electronic components. The compound's properties make it a reliable choice for protecting and ensuring the performance of critical components in challenging environments.

Cosmic Epoxy E4930R is a mineral-filled epoxy molding compound supplied in granular form. It is designed for encapsulating various electronic components, including optocouplers, capacitors, resistors, resistor networks, transistors, SOICs (Small Outline Integrated Circuits), and QFPs (Quad Flat Packages). This material helps protect and insulate these components, ensuring their proper functioning in electronic applications.

Farboset® 2270 is a granular epoxy molding compound that contains a combination of glass and mineral fillers. It is based on a novolac epoxy resin and is designed for encapsulating various electrical and electronic components, including capacitors, resistors, hybrids, and more. This compound is known for its good moldability and fast cure rates, especially at lower molding temperatures. It offers excellent performance and reliability for applications where these characteristics are crucial.

Cosmic Epoxy E4920CD is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, offered as granules, preforms, or powders, and is available in various colors. This product has a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.

Cosmic Epoxy E4920AT is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and comes in various colors. This product has a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.

Cosmic Epoxy E4920AC is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and is offered in various colors. This product features a mild odor and is insoluble in water, making it suitable for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.

DAP ID-50 is a general-purpose diallyl ortho-phthalate molding compound filled with Dacron. It is supplied in a granular form and can be easily molded using standard compression or transfer equipment. This type of compound is versatile and suitable for various molding applications.

Farboset® 2510 is a mineral-filled, novolac epoxy molding compound known for its fast cure rates at low temperatures, excellent laser markability, and good moldability. This compound is specially formulated for encapsulating surface mount ceramic and tantalum capacitors, as well as other applications that demand quick cycle times. Its unique properties and rapid curing make it well-suited for applications where fast production and efficient marking are essential.

DAP D44/6160 is a mineral-filled, special-purpose diallyl ortho-phthalate molding compound supplied in a free-flowing granular form. It can be easily molded using compression, transfer, or injection equipment and can be readily preformed. It surpasses all mineral compounds available today in terms of mechanical and electrical properties. It boasts extremely low water absorption, high dielectric strength, and a low dissipation factor, along with high tensile strength, exceptional arc resistance, and excellent resistance to high temperatures.

Cosmic Epoxy EH81 is an iron-filled epoxy molding compound available in a black granular form. It is specifically designed for EMI/RFI shielding applications and can be used in both compression and transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to simplify the manufacturing process by eliminating the labor-intensive over/under molding steps.

Farboset® 1115AC is intended for use as a compound in thermoset molding. It is available in a solid form, presented as granules, with a granular appearance and a mild odor. This product is insoluble in water and does not exhibit reactivity under normal conditions, making it suitable for various thermoset molding applications and ensuring safety and reliability in its intended use.

Farboset® 2477BB is designed for use as a compound in thermoset molding. It is available in a solid form, presented as granules, with a granular appearance and a mild odor. This product is insoluble in water and does not exhibit reactivity under normal conditions. It is well-suited for a variety of thermoset molding applications, ensuring safety and reliability in its intended use.

Cosmic Epoxy E4940P is a mineral-filled, glass-reinforced epoxy molding compound supplied in granular form. It is specifically designed for high-volume encapsulation applications, particularly for resistor networks and fiber-optic connectors. This compound offers high quality, reliability, and good moldability for such applications.

Farboset® 1712 is designed for use as a compound in thermoset molding. It is available in a solid form, presented as granules, with a granular appearance and a mild odor. This product is insoluble in water and does not exhibit reactivity under normal conditions. It is well-suited for a variety of thermoset molding applications, ensuring safety and reliability in its intended use.

Cosmic Epoxy EH71 is an iron-filled epoxy molding compound available in a black granular form. It is well-suited for EMI/RFI shielding applications and can be used in either compression or transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to streamline the manufacturing process by eliminating the labor-intensive over/under molding steps.

Farboset® 1160 is a granular, mineral-filled, anhydride epoxy molding compound designed for the encapsulation of various electrical and electronic components. It offers fast cure rates, long flow, and excellent thermal shock resistance. This compound is suitable for applications involving the encapsulation of coils, transformers, capacitors, diodes, relays, and other components that require good hot rigidity during the molding process.

Farboset® 1115 is a granular, mineral-filled, anhydride epoxy molding compound with fast cure rates and excellent hot strength. It is specially designed for encapsulating various electrical and electronic components, including coils, transformers, bushings, switches, and more. The material offers good hot rigidity during the molding process and is commonly used in injection and transfer molding applications.

Cosmic Epoxy EH51 is an iron-filled epoxy molding compound available in a black granular form. It is designed for EMI/RFI shielding applications and can be used in compression or transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. This material simplifies the manufacturing process by allowing for single molded applications, eliminating the labor-intensive over/under molding.

Farboset® 2471VO is designed for use as a compound in thermoset molding. It is available in a solid form, presented as granules, with a granular appearance and a mild odor. This product is insoluble in water and does not exhibit reactivity under normal conditions. It is well-suited for various thermoset molding applications, ensuring safety and reliability in its intended use.

Cosmic Epoxy E4920FC is a mineral-filled epoxy molding compound available either in granular form or preformed in a variety of sizes and weights. It offers excellent moisture resistance, thermal cycling stability, and outstanding moldability. Parts molded from this material also resist fungus growth and are designed for the encapsulation of passive devices such as capacitors, inductors, diodes, and rectifiers.

DAP ID-40 is a general-purpose diallyl ortho-phthalate molding compound filled with Orlon. It is supplied in a granular form and can be easily molded using standard compression or transfer equipment. This type of compound is versatile and suitable for various molding applications.

Cosmic Epoxy EH61 is an iron-filled epoxy molding compound provided in a black granular form. It is designed for EMI/RFI shielding applications and can be utilized in compression or transfer molding processes to manufacture core rods or encapsulate surface mount and axial leaded inductors. This single molded compound streamlines the manufacturing process, eliminating the labor-intensive over/under molding steps.

Cosmic Epoxy E4920D is a mineral-filled epoxy molding compound that is available in either granular form or as preformed shapes in various sizes and weights. This compound is commonly used for molding applications and offers good versatility in manufacturing processes.

Cosmic Epoxy EH31 is an iron-filled epoxy molding compound available in a granular form with a black color. This material is designed for EMI/RFI shielding applications. It can be used for compression or transfer molding to create core rods and encapsulate surface mount and axial leaded inductors. Using this single molded compound can streamline the manufacturing process and eliminate the need for labor-intensive over/under molding.

Cosmic Epoxy EH21 is an iron-filled epoxy molding compound provided in a black granular form. It is well-suited for applications requiring EMI (Electromagnetic Interference) and RFI (Radio-Frequency Interference) shielding. This material can be molded through compression or transfer molding processes to create core rods or to encapsulate surface mount and axial leaded inductors. It offers the advantage of simplifying the molding process by eliminating the need for labor-intensive over/under molding.

DAP D45 is a mineral-filled, flame retardant, general-purpose diallyl ortho-phthalate molding compound supplied in a free-flowing granular form. It offers a cost-effective solution while maintaining essential properties such as high dimensional stability, arc resistance, and excellent dielectric strength. This compound is well-suited for structural parts, housings, terminals, insulators, and other applications where both strength and economy are important factors.

Cosmic Epoxy E4920VS is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and is offered in various colors. This product features a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.