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Products in Adhesives & Sealants
963 Products found in Adhesives & Sealants
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Palm Labs Adhesives
Turbo Fuse 170 ME, Methyl
Applications:
Exterior & Body, Stationery, Art & Office Supplies, Equipment & Parts
Product Families:
Anaerobic Adhesives, Adhesives & Sealants
Chemical Family:
Cyanoacrylates
Turbo Fuse 170 ME, Methyl metal cyanoacrylate adhesive is designed to polymerize instantly by absorbing surface moisture. This cyanoacrylate adhesive is specifically formulated to bond various metals including aluminum, stainless steel, and copper, to itself and to a variety of materials including wood, balsa wood, rubber, plastics and leather.
EpoxySet Inc.
EpoxySet Inc. UVX-070219
Product Type:
1K (1 component) Adhesive
Compatible Substrates & Surfaces:
Plastics, Metal
Cure Method:
Radiation Cure
Chemical Family:
Urethanes
UVX‐070219 is a low viscosity, fast curing urethane acrylate that bonds well to engineered plastics and metal substrates. This product requires direct UV exposure during cure. Because of the variability of different UV light sources it is suggested that the user test and specify UV intensity and exposure time. This material is specially formulated to have reduces surface tack due to oxygen inhibition.
AI Technology
AI Technology BGF 7120
Applications:
Appliances & Electronics, Semiconductor Manufacturing, Adhesives & Sealants
Product Families:
Contact Adhesives, Adhesives & Sealants
Creative Materials Inc.
Creative Materials 126-37-F
Applications:
Consumer Electronics, Appliances & Electronics, Adhesives & Sealants
Product Families:
Conductive Adhesives, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
126-37-F is an anisotropically conductive transferable low CTE adhesive film. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other substrates. 126-37 is designed to exhibit minimal flow during bonding. This product provides superior electrical conductivity when bonding circuit materials to metal back planes and heat sinks. This product has excellent adhesion to aluminum, ceramic, and a variety of other substrates. This system features excellent thermal stability and flexibility in the B-Staged form. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. The product can be re-bonded many times by simply adding heat and slight pressure
AI Technology
AI Technology ESP 8450-DAF
Applications:
Semiconductor Manufacturing, Printed Circuit Boards (PCBs), Appliances & Electronics
Product Families:
Conductive Adhesives, Adhesives & Sealants
AI Technology
AI Technology MC 8880
Applications:
Consumer Electronics, Adhesives & Sealants, Appliances & Electronics
Product Families:
Conductive Adhesives, Adhesives & Sealants
Chemical Family:
Cyanate Esters
MC8880 is a one part, silver-filled cyanate ester adhesive that is electrically and thermally conductive. It is designed for use in both chip and component level attach application to reduce stress. It can withstand temperatures up to 300°C without thermal degradation. Its unique chemistry results in very low moisture absoption, high adhesive strength.
Premier Building Solutions
XtraBond® 1500NS - Non Skinning Premium Grade Butyl Sealant
Applications:
Industrial Manufacturing, Industrial Adhesives & Sealants, Sealants & Caulks
Product Families:
Caulks & Sealants, Adhesives & Sealants
AI Technology
AI Technology EG 7655
Applications:
Appliances & Electronics, Equipment & Parts, Adhesives & Sealants
Product Families:
Other Adhesives & Sealants, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
EG7655 is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials with highly mismatched CTE'S (i.e., alumina to aluminum, silicon to copper). EG7655's high thermal conductivity and flexibility make it excellent for bonding large area substrates, components and heat sinks where thermal management is critical. EG7655 exhibits reduced bond strength at 80-100°C for easier rework. The cured adhesive is flexible with Type A hardness of 80 and tensile elongation of more than 30%.
Novum Glass LLC.
Novum Glass U-212
Functions:
Filler
Synonyms:
Glass, oxide, chemicals, Oxide glass chemicals
U-212 used in a variety of industries for maintaining a consistent space between objects, allowing for more repeatable results and fewer rejected parts.
Atmos Technologies
Viplex LS
Functions:
Reactive Diluent, Rheology Modifier
Chemical Family:
Hydrocarbons
Compatible Polymers & Resins:
Epoxies (EP), Polyurethanes (PU)
Viplex LS is a low viscosity diluent of PU and epoxy systems with excellent compatibility.
EpoxySet Inc.
EPOXIBOND™ EB-107LP-2
Chemical Family:
Epoxy & Epoxy Derivatives
Product Type:
2K (2 component) Adhesive, Adhesive
Cure Method:
Heat Cure, Air Dry
Application Area:
Semiconductors, Photonic Devices, Optical Applications, Medical Devices, Semiconductor Die Attach, Optoelectronics Devices, Interconnect
Compatible Substrates & Surfaces:
Wood, Glass, Plastics, Metal
FLASHBOND™ UV-3607HTis a 1-component, UV/Thermal cure adhesive & sealant. This material can cure under moderate intensity UV light as well as elevated temperatures for shadowed areas. Its low viscosity is ideal for coating, capillary action, and doming applications. Unlike traditional dual cure epoxy systems which need light + heat, UV-3607HT can cure either with UV/LED light or with heat.
AI Technology
AI Technology ESP 8450-WL
Applications:
Semiconductor Manufacturing, Adhesives & Sealants, Appliances & Electronics
Product Families:
Conductive Adhesives, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
ESP8450-WL is a high melt-flow version of standard ESP8450 designed for large area bonding and wafer-level lamination for stack-chip applications. It is a solvent resistant, silver-filled, flexible epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier. This novel, B-staged electrically conductive adhesive offers excellent flexibility from-55°C to 150°C. The dry, tack-free handling of the film makes it ideal for an automated pick and place assembly and is reworkable from 80°C to 150°C. ESP8450-WL has excellent thermal conductivity and its low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or shock testing.
AI Technology
AI Technology RTC 8750
Applications:
Semiconductor Manufacturing, Appliances & Electronics, Adhesives & Sealants
Product Families:
Conductive Adhesives, Adhesives & Sealants
AI Technology
AI Technology TP 7209
Applications:
Equipment & Parts, Semiconductor Manufacturing, Appliances & Electronics
Product Families:
Pressure Sensitive Adhesives & Tapes, Adhesives & Sealants
TP7209 is a low bond strength thermoplastic film adhesive. It is designed for bonding heat-sink, component, and substrate. This unique diamond flled material has excellent thermal conductivity and is tacky at room temperature.
CoolMag Thermo Conductive, S.L.
COOLMAG™ PU 10
Applications:
Sensors & Actuators, Electrical & Electronic Systems, Semiconductor Manufacturing
Product Families:
Encapsulants, Conductive Adhesives, Adhesives & Sealants
CoolMag™ PU 10 is a thermally conductive composite PDMS based elastomeric compound of encapsulant two component system, designed for Power Electronics in general and for Automotive, especially in Electrified Vehicles with multiple functionalities: Heat Transfer, reduction of hot spots and minimizing average temperature of systems Electric Isolation Mechanical protection Flame and fire protection (Retardant and Extinction)
NovaCentrix
NovaCentrix Silver Nanopowder
Chemical Name:
Silver
CAS Number:
7440-22-4
Functions:
Conductive Agent
Chemical Family:
Silver & Silver Compounds
Synonyms:
Ag
NovaCentrix manufactures silver nanopowder with average particle size of 25 nm, with a specific surface area of 23 m2 /gm. Silver nanopowder is used in electrically conductive inks for inkjet and flexographic printing. Silver has also been shown to have antimicrobial properties. Nanopowder offers tight size control, high purity, and excellent dispersibility. A top performer for many applications, including, photovoltaics, displays, energy storage, RFID and smart packaging. Also used in electrically conductive inks and adhesives for inkjet and flexographic printing.
Novum Glass LLC.
Novum Glass U-425
Functions:
Filler
U-425 used in a variety of industries for maintaining a consistent space between objects, allowing for more repeatable results and fewer rejected parts.
AI Technology
AI Technology ME 8650-RC
Applications:
Semiconductor Manufacturing, Adhesives & Sealants, Appliances & Electronics
Product Families:
Conductive Adhesives, Adhesives & Sealants
ME8650-RC is designed for needle dispensing and screen-printing processing. This silver filled conductive die-attach adhesive can be rapidly cured at low temperatures. This single component, silver filled paste is ambient storable electrically and thermally conductive. It is highly thixotropic with minimal sag. ME8650-RC has been designed to minimize bleeding on both silver plated copper and alloy 42 lead frames. Maintains more than 100 psi bond strength at 250°C for wire-bonding.
AI Technology
AI Technology MC 7685-GTS
Applications:
Appliances & Electronics, Adhesives & Sealants, Packaging & Assembly
Product Families:
Encapsulants, Adhesives & Sealants
Palm Labs Adhesives
Palm Labs Adhesives Turbo Bond 300
Product Type:
Reactive Adhesive, 2K (2 component) Adhesive
Application Area:
Marine Applications, Signage, Furniture, Metal Fabrication
Compatible Substrates & Surfaces:
Fiberglass, Wood, Aluminum, Composites, Stainless Steel, Metal
Chemical Family:
Methacrylates
Palm Labs Adhesives Turbo Bond 300 is a two-component, 100% reactive, toughened structural methacrylate adhesive specifically formulated for bonding wide variety of metals, thermoplastics, thermosets, and composite assemblies.
AI Technology
AI Technology ME 7656
Applications:
Consumer Electronics, Semiconductor Manufacturing, Adhesives & Sealants
Product Families:
Conductive Adhesives, Adhesives & Sealants
ME7656 is a reworkable, boron-nitride crystallite filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The very high thermal conductivity of this material makes it useful for bonding high- powered, large area die and components.
AI Technology
AI Technology ME 7638-RC
Applications:
Appliances & Electronics, Adhesives & Sealants, Packaging & Assembly
Product Families:
Other Adhesives & Sealants, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
Palm Labs Adhesives
Turbo Fuse Methyl for Metals
Product Type:
1K (1 component) Adhesive
Application Area:
Name Plates, Wiper Blades, Machine Parts
Compatible Substrates & Surfaces:
Elastomers & Rubbers, Wood, Leather, Aluminum, Stainless Steel, Copper, Metal
Chemical Family:
Cyanoacrylates
Turbo Fuse Methyl for Metals is advanced formula is designed to polymerize instantly by absorbing surface moisture and is specifically formulated to bond various metals including aluminum, stainless steel, and copper, to itself and to a variety of materials including wood, balsa wood, rubber, plastics and leather. Applications include wiper blades, nameplates, gearshift indicators, aerospace parts, automotive and machinery parts, electronic components, transportation equipment, etc.
AI Technology
AI Technology TP 7858
Applications:
Adhesives & Sealants, Appliances & Electronics, Printed Circuit Boards (PCBs)
Product Families:
Other Adhesives & Sealants, Adhesives & Sealants
Premier Building Solutions
XtraFoam™ HH - Hand Held Minimal Expanding Foam Sealant
Product Type:
1K (1 component) Sealant
Application Area:
Pipes, Electrical Components, Window Frames, Air Conditioner Filters, Door Frames
Compatible Substrates & Surfaces:
Wood, Aluminum, Metal
Application Method:
Gun
Chemical Family:
Polyurethanes (PU)
AI Technology
AI Technology RTC 8550
Applications:
Semiconductor Manufacturing, Adhesives & Sealants, Appliances & Electronics
Product Families:
Other Adhesives & Sealants, Adhesives & Sealants
Suncolor Corporation
SUNSPHERES™ 15.0
Functions:
Filler
Chemical Family:
Silica
Optically clear, solid fused amorphous silica microspheres specially engineered for paints, coatings, inks, adhesives, and thermoplastics, including UV curable compositions. These microspheres increase corrosion resistance, reduce shrinkage, improve adhesion and impact resistance, and enhance surface qualities including mar and scratch resistance. The Sunspheres™ 15.0 have a median particle size of approximately 15.0 microns, with 90% of particles passing 45 microns.
AI Technology
AI Technology ESP 7660-FOW
Applications:
Adhesives & Sealants, Appliances & Electronics, Packaging & Assembly
Product Families:
Conductive Adhesives, Adhesives & Sealants
EpoxySet Inc.
FLASHBOND™ UV-8300LV
Chemical Family:
Epoxy & Epoxy Derivatives
Product Type:
Encapsulant, Epoxy Adhesive, Potting Compound
Application Area:
Electronic Components
Compatible Substrates & Surfaces:
Glass, Plastics, Metal, Ceramic
SetWORX™ 05 is a fast cure, high strength, structural epoxy adhesive. This adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties. The high performance epoxy provides excellent bond strengths to a wide variety of plastics and metals.
Leepoxy Plastics
Leebond 37-75
Applications:
Appliances & Electronics, Other Adhesives & Sealants Applications, Other Wire & Cable Applications
Product Families:
Encapsulants, Structural Adhesives, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
LEEBOND 37-75 is a proprietary two-part epoxy adhesive used in both electrical-grade potting and structural adhesive applications. Cured systems demonstrate excellent toughness, impact resistance and exceptional bond strength for hard to bond to substrates. This system can be cured at both room temperature or accelerated with modest heating.
AI Technology
Paste Z-Poxy™ ZME 8450-FP
Applications:
Appliances & Electronics, Connectors, Adhesives & Sealants
Product Families:
Conductive Adhesives, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
AI Technology
FLUOROSEAL® LS-UVF 7350
Applications:
Equipment & Parts, Semiconductor Manufacturing, Appliances & Electronics
Product Families:
Conductive Adhesives, Adhesives & Sealants
Permabond Engineering Adhesives
PERMABOND® TA459
Applications:
Appliances & Electronics, Other Adhesives & Sealants Applications, Adhesives & Sealants
Product Families:
Structural Adhesives, Adhesives & Sealants
Chemical Family:
Acrylics, Acrylates & Methacrylates
PERMABOND® TA459 is a structural acrylic adhesive designed primarily for bonding metals, ferrites, ceramics and some thermoplastics. This product was specifically designed to be non-corrosive to sensitive copper parts or other electrically conductive surfaces. The fast curing rate and rapid strength development of this material allows for increased production rate.
NuSil Technology
NuSil™ MED-6210
Applications:
Medical Devices & Assemblies, Adhesives & Sealants, Appliances & Electronics
Product Families:
Encapsulants, Adhesives & Sealants
Chemical Family:
Silicones
End Uses:
Drug Delivery Pens
NuSil™ MED-6210 is a optically clear low viscosity silicone elastomer.
NuSil Technology
NuSil™ CV10-2500
Applications:
Adhesives & Sealants, Appliances & Electronics, Other Devices & Assemblies
Product Families:
Encapsulants, Adhesives & Sealants
Chemical Family:
Silicones
NuSil™ CV10-2500 is a controlled volatility silicone. For applications requiring low outgassing and minimal volatile condensable under extreme operating conditions.
NuSil Technology
NuSil™ MED-6015
Applications:
Medical Devices & Assemblies, Adhesives & Sealants, Appliances & Electronics
Product Families:
Encapsulants, Adhesives & Sealants
Chemical Family:
Silicones
End Uses:
Drug Delivery Pens
NuSil™ MED-6015 is a optically clear low viscosity silicone elastomer.
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