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Products in Adhesives & Sealants
3,928 Products found in Adhesives & Sealants
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EpoxySet Inc.
EpoxySet Inc. EC-1012M/EH-20M
Ready to Use Product Type:
Encapsulant, Potting Compound
Application Areas:
Capacitor Bushings, Power Transformers, Integrated Circuits
Chemical Family:
Epoxy & Epoxy Derivatives
EC-1012M/EH-20M is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.
EpoxySet Inc.
EPOXICAST™ 1006M-4
Ready to Use Product Type:
Encapsulant, Potting Compound
Application Areas:
Capacitor Bushings, Power Transformers, Integrated Circuits
Chemical Family:
Epoxy & Epoxy Derivatives
EC-1006M-4 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.
EpoxySet Inc.
URACAST™ UXP-052107-1
Ready to Use Product Type:
2K (2 component) Adhesive, Potting Compound, Encapsulant
Application Areas:
Relays, Coils, Printed Circuit Boards, Rectifiers, TV Sets, Amplifiers
Chemical Family:
Urethanes
UXP-052107-1 is a filled, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release.
EpoxySet Inc.
EPOXICAST™ EC-1850FT/EH-10E
Ready to Use Product Type:
Potting Compound, Encapsulant
Application Areas:
Oscillators, Power Transformers, Amplifiers
Chemical Family:
Epoxy & Epoxy Derivatives
EC-1850FT with EH-10E Hardener is a very low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.
EpoxySet Inc.
EPOXIBOND™ 142HT-1
Ready to Use Product Type:
Adhesive
Application Areas:
Fiber Optic Cables, Capacitors, Capacitor Bushings, Semiconductors, Medical Devices, Electronic Components
Compatible Substrates & Surfaces:
Metal, Ceramic, Glass
Chemical Family:
Epoxy & Epoxy Derivatives
EB-142HT-1 is unfilled, low viscosity, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates.
EpoxySet Inc.
EPOXICAST™ EC-1006
Ready to Use Product Type:
Encapsulant, Potting Compound
Application Areas:
Capacitor Bushings, Power Transformers, Integrated Circuits
Chemical Family:
Epoxy & Epoxy Derivatives
EPOXICAST-1006/EH-24 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. The cured system provides excellent resistance to moisture, most organic solvents and inorganic chemicals.
EpoxySet Inc.
EpoxySet Inc. UB-50
Ready to Use Product Type:
Encapsulant, Potting Compound, 2K (2 component) Adhesive
Compatible Substrates & Surfaces:
Metal, Plastics, Ceramic
Chemical Family:
Urethanes
UB-50 is a clear, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release. The cured elastomer has excellent bond to metals, ceramics, and many plastics used in medical industry such as acrylic, polycarbonate, PVC etc. They also have excellent water resistance, and are exceptionally resistant to thermal shock. They can be used as an adhesive or for potting, casting and encapsulating applications.
EpoxySet Inc.
URACAST™ UC-2524
Ready to Use Product Type:
2K (2 component) Adhesive, Encapsulant
Application Areas:
Relays, Coils, Printed Circuit Boards, Rectifiers, TV Sets, Amplifiers
Chemical Family:
Urethanes
UC-2524 is a filled, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.
EpoxySet Inc.
FLASHBOND™ UV-3610
Ready to Use Product Type:
Epoxy Adhesive
Cure Method:
Heat Cure
Chemical Family:
Epoxy & Epoxy Derivatives
FLASHBOND™ UV-6502CL is a low viscosity, high clarity, light curing epoxy adhesive that offers excellent strength wetting properties. UV-6502CL cures to a clear polymer and maintains clarity at elevated temperatures. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cures best in the UVA wavelengths (315-365nm).
EpoxySet Inc.
EpoxySet Inc. EB-126HT
Ready to Use Product Type:
2K (2 component) Adhesive
Application Areas:
Electrical Components
Chemical Family:
Novolac Epoxy, Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol F Type Epoxy
EB-126HT is two components, clear epoxy system. This long work life, low viscosity resin system is designed for the bonding, coating, sealing, and impregnation of electrical and structural components. The cured system has excellent electrical and physical properties above 250°C with outstanding high temperature stability. It also provides excellent moisture, chemical, and corrosion resistance as well as resistance to thermal and mechanical shock.
EpoxySet Inc.
EPOXIBOND™ EB-316TM
Ready to Use Product Type:
Structural Adhesive
Application Areas:
Medical Devices
Chemical Family:
Epoxy & Epoxy Derivatives
EB-316TM is a thixotropic version of EB-316M, a high strength, semi-rigid epoxy adhesive. This tough adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high-performance medical grade epoxy adhesive passes 500 thermal cycles from - 50°C to 150°C. EB-316M is excellent for cryogenic temperature applications.
EpoxySet Inc.
URACAST™ UC-2356
Ready to Use Product Type:
2K (2 component) Adhesive, Potting Compound, Encapsulant
Application Areas:
Relays, Coils, Printed Circuit Boards, Rectifiers, TV Sets, Amplifiers
Chemical Family:
Urethanes
UC-2356 is a two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows for easy flow and air release and excellent hydrolytic stability. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.
EpoxySet Inc.
EPOXIBOND™ EB-316TC-2
Ready to Use Product Type:
Structural Adhesive
Application Areas:
Printed Circuit Boards, Semiconductors
Chemical Family:
Epoxy & Epoxy Derivatives
EB-316TC-2 is a two component, thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer, medical or optics.
EpoxySet Inc.
URACAST™ UC-2350
Ready to Use Product Type:
2K (2 component) Adhesive, Potting Compound, Encapsulant
Application Areas:
Relays, Coils, Printed Circuit Boards, Rectifiers, TV Sets, Amplifiers
Chemical Family:
Urethanes
UC-2350 is a two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows for easy flow and air release and excellent hydrolytic stability. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.
EpoxySet Inc.
EPOXIBOND™ EB-430-1HT
Chemical Family:
Epoxy & Epoxy Derivatives
Ready to Use Product Type:
Encapsulant
Application Areas:
Power Transformers, Semiconductors, Integrated Circuits, Electrical Components
EB-430-1HT is a highly versatile epoxy adhesive formulated for semiconductor industry. An easy to dispense liquid paste, it offers high heat transfer, low shrinkage and a coefficient of thermal expansion comparable to that of copper and aluminum. This adhesive is designed for protecting IC's in TAB, as well as glob-top encapsulant for COB placement. Other applications include fabricating heat sinks, bonding semiconductors and transistors to heat sinks and general-purpose bonding of electronic components.
EpoxySet Inc.
EPOXIBOND™ EB-316M
Ready to Use Product Type:
Structural Adhesive
Application Areas:
Medical Devices
Chemical Family:
Epoxy & Epoxy Derivatives
EB-316M is a semi-rigid, high strength structural epoxy adhesive. This tough adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high-performance medical grade epoxy adhesive passes 500 thermal cycles from -50°C to 150°C. EB-316M is excellent for cryogenic temperature applications.
EpoxySet Inc.
EPOXICAST™ EC-1009
Ready to Use Product Type:
Encapsulant, Potting Compound
Application Areas:
Capacitor Bushings, Power Transformers, Integrated Circuits
Chemical Family:
Epoxy & Epoxy Derivatives
EC-1009 is a pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.
Chicago Glue & Machine
Chicago Glue & Machine HME3122LTPEL
Ready to Use Product Type:
Hot-Melt Adhesive
Chicago Glue & Machine HME3122LTPEL is a formulated low temperature applied hot melt primarily used in packaging applications. HME3122LTPEL has aggressive hot tack, excellent adhesion, and excellent machining properties. HME3122LTPEL exhibits fast set speeds.
Chicago Glue & Machine
Chicago Glue & Machine 5221 100
Ready to Use Product Type:
Hot-Melt Adhesive
Compatible Substrates & Surfaces:
Stainless Steel, Coated Surfaces, Styrene Butadiene Styrene (SBS), Metal
Chemical Family:
Ethylene Vinyl Acetate (EVA)
Chicago Glue & Machine 5221 100 is fast setting, good hot tack glue stick designed for end of line packaging. Typically used to bond uncoated, clay coated, SBS, SUS, an similar uncoated and lightly coated materials.
Creative Materials Inc.
Creative Materials 122-39(SD)
Ready to Use Product Type:
Epoxy Adhesive, Conductive Adhesive, Solvent free (100% Solids) Adhesive, 1K (1 component) Adhesive
Application Method:
Injection
Chemical Family:
Epoxy & Epoxy Derivatives
122-39(SD) is a syringe dispensable, thermally conductive, electrically insulating, one component, 100% solids epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesion to gold plated substrates and tin/lead solder terminated components, die attach and thermal management operations, printed circuit board fabrication, advanced material composites, sealing and high performance coatings. 122-39(SD) is a thermally conductive version of 122- 38(SD).Features Ionically clean die attach adhesive
Creative Materials Inc.
Creative Materials 128-38
Ready to Use Product Type:
1K (1 component) Adhesive, Epoxy Adhesive
Application Areas:
Hermetic Package
Cure Method:
Heat Cure
Application Method:
Screen Coating
Chemical Family:
Epoxy & Epoxy Derivatives
128-38 is a screen-printable, B-Stageable, one-part epoxy coating and laminating adhesive that maintains hermetic properties up to 170°C. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include lid attach adhesives, printed circuit board fabrication, advanced material composites, sealing, and high-performance coatings.Features Hermetic properties B-Stageable Long Screen Life High Tg Hermetic lid attach
Creative Materials Inc.
Creative Materials 109-12
Ready to Use Product Type:
Conductive Adhesive, 1K (1 component) Adhesive, Potting Compound, Epoxy Adhesive
Application Method:
Injection
Chemical Family:
Epoxy & Epoxy Derivatives
109-12 is a one component, highly thermally conductive, low stress, low shrink potting compound and adhesive. 109-12 features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring class "F+" service temperature rating. 109-12 is a more thermally conductive version of 108-50.Features Low stress High thermally conductive adhesive/potting compound
Creative Materials Inc.
Creative Materials 126-37
Ready to Use Product Type:
Epoxy Adhesive, Conductive Adhesive, 1K (1 component) Adhesive
Application Areas:
Electrical Components
Compatible Substrates & Surfaces:
Ceramic, Aluminum, Metal
Application Method:
Injection, Screen Coating
Chemical Family:
Epoxy & Epoxy Derivatives
126-37 is a screen-printable, B-Stageable, anisotropic conductive, one part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 126-37 is designed to exhibit minimal flow during bonding. This product provides superior electrical conductivity when bonding circuit materials to metal back planes and heat sinks. This product has excellent adhesion to aluminum, ceramic, and a variety of other substrates. Additional applications include, but are not limited to, assembling electrical and electronic components. This system features excellent thermal stability and flexibility in the B-Staged form. 126-37 is an anisotropic conductive version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance
Creative Materials Inc.
Creative Materials 102-12A/B-187
Ready to Use Product Type:
Epoxy Sealant, Potting Compound, 2K (2 component) Sealant
Cure Method:
Air Dry
Chemical Family:
Epoxy & Epoxy Derivatives
102-12/B-187 is a black, two component, thermally conductive epoxy potting and encapsulating compound. This product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 102-12/B-187 exhibits excellent thermal shock resistance and is especially suited to protecting sensitive electronic devices from a range of operating conditions including moisture, vibration, and temperature variation. Other useful applications include, but are not limited to, potting relays, electronic controls, sensors, and inverters and sealing of electronic component housings. Using B-187 allows for faster curing compared to B119-44.FeaturesSame as above, but extended pot life; better resistance to thermal cracking.
Creative Materials Inc.
Creative Materials 108-50
Ready to Use Product Type:
Conductive Adhesive, 1K (1 component) Adhesive, Potting Compound, Epoxy Adhesive
Application Method:
Injection
Chemical Family:
Epoxy & Epoxy Derivatives
108-50 is a one component, thermally conductive, low stress, low shrink potting compound and adhesive. 108-50 features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring Class "F" service temperature rating. 108-50 can also be used as an adhesive for bonding stress sensitive substrates.Features Low stress, moderate thermally conductive adhesive/potting compound
Creative Materials Inc.
Creative Materials 124-19A/B2713
Ready to Use Product Type:
Conductive Adhesive, 2K (2 component) Adhesive, Epoxy Adhesive
Application Areas:
Electrical Components
Cure Method:
Air Dry
Application Method:
Injection
Chemical Family:
Epoxy & Epoxy Derivatives
124-19 is a two part, room temperature curing, anisotropic conductive epoxy adhesive. The system is designed for making electrical and mechanical attachments on electrical components and devices. Unlike typical room temperature curing systems, this product always results in excellent anisotropic conductivity and is less sensitive to handling and ambient conditions. Complimentary B components allow for customization of end properties. Use B2713 for more flexibility and lower stress; use the standard B component for high strength requirements.Features Room temperature curing High bond strength Increased flexibility
Creative Materials Inc.
Creative Materials 124-22C
Ready to Use Product Type:
Epoxy Adhesive, Conductive Adhesive
Application Areas:
Ribbon Cables, Electrical Components
Compatible Substrates & Surfaces:
Plastics, Polyimide, Glass, Metal
Application Method:
Screen Coating
Chemical Family:
Epoxy & Epoxy Derivatives
124-22C is a pre catalyzed, solvent-resistant, anisotropic conductive ink, coating and adhesive. This product features excellent adhesion to Kapton, Mylar, glass, polycarbonate and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to methyl ethyl ketone. It is also very resistant to scratching and creasing. Applications for 124-22C include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of surface mounted devices. This product is useful in application where shorts between closely spaced contacts is a concern.Features Solvent resistant, low temperature curing epoxy adhesive
Creative Materials Inc.
Creative Materials 125-31FPC
Ready to Use Product Type:
Epoxy Adhesive, Conductive Adhesive, Solvent free (100% Solids) Adhesive, 1K (1 component) Adhesive
Application Method:
Injection
Chemical Family:
Epoxy & Epoxy Derivatives
125-31FPC is a syringe dispensable, 100 % solids, thermally conductive, electrically insulating, pre-catalyzed epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 125-31FPC is flexible and is able to absorb stress when bonding mismatched CTE substrates. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. 125-31FPC is a finer particle version of 125-31C.Features Highly thermally conductive epoxy adhesive B-Stageable Low temperature curing
Creative Materials Inc.
Creative Materials 124-19A/B
Ready to Use Product Type:
Conductive Adhesive, 2K (2 component) Adhesive, Epoxy Adhesive
Application Areas:
Electrical Components
Cure Method:
Air Dry
Application Method:
Injection
Chemical Family:
Epoxy & Epoxy Derivatives
124-19 is a two part, room temperature curing, anisotropic conductive epoxy adhesive. The system is designed for making electrical and mechanical attachments on electrical components and devices. Unlike typical room temperature curing systems, this product always results in excellent anisotropic conductivity and is less sensitive to handling and ambient conditions. Complimentary B components allow for customization of end properties. Use B2713 for more flexibility and lower stress; use the standard B component for high strength requirements.Features Room temperature curing High bond strength
Creative Materials Inc.
Creative Materials 127-04
Ready to Use Product Type:
Structural Adhesive, 1K (1 component) Adhesive, Epoxy Adhesive
Application Method:
Screen Coating
Chemical Family:
Epoxy & Epoxy Derivatives
127-04 is a screen-printable, B-Stageable, one part epoxy coating and laminating adhesive. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings.Features B-Stageable laminating adhesive
Creative Materials Inc.
Creative Materials 127-45
Ready to Use Product Type:
Epoxy Adhesive, Conductive Adhesive, 1K (1 component) Adhesive
Compatible Substrates & Surfaces:
Painted Surfaces
Application Method:
Injection
Chemical Family:
Epoxy & Epoxy Derivatives
127-45 is a die attach adhesive engineered for high reliability performance and high efficiency production. This product is a syringe dispensable, anisotropic conductive, one component, 100% solids epoxy adhesive and features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesion to gold plated substrates and tin/lead solder terminated components, die attach operations, printed circuit board fabrication, advanced material composites, sealing and high performance coatings. 127-45 is an anisotropic conductive version of Electraset™ 620.Features Die attach adhesive
Zaclon
Zaclon Volan Bonding Agent
Compatible Substrates & Surfaces:
Fibers & Fabrics, Glass, Metal
Creative Materials Inc.
Creative Materials 128-32-25
Ready to Use Product Type:
Epoxy Adhesive, Conductive Adhesive
Application Areas:
Ribbon Cables, Electrical Components
Compatible Substrates & Surfaces:
Metal
Application Method:
Dip Coating, Injection, Screen Coating
Chemical Family:
Epoxy & Epoxy Derivatives
128-32-25 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32-25 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32-25 is optimized for a 0.001†bond line.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance Excellent Room Temperature Stability
Creative Materials Inc.
Creative Materials 123-34
Ready to Use Product Type:
1K (1 component) Adhesive, Epoxy Adhesive, Structural Adhesive
Application Method:
Dip Coating, Pad Printing, Injection
Chemical Family:
Epoxy & Epoxy Derivatives
123-34 is a pad-printable, B-Stageable, one part epoxy coating and adhesive, suitable for application by pad printing, dipping and syringe dispensing. This system has been pre-catalyzed with CMI 119-44 to allow for low temperature cure. This product features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings. 123-34 is a pre-catalyzed version of 122- 48.Features B-Stageable Epoxy Adhesive
Creative Materials Inc.
Creative Materials 805-19C
Ready to Use Product Type:
Conductive Adhesive, 1K (1 component) Adhesive, Epoxy Adhesive
Cure Method:
Air Dry
Application Method:
Injection
Chemical Family:
Epoxy & Epoxy Derivatives
The 805-19C is a one-component, high performance, silver filled room temperature curable epoxy adhesive.Features One component room temperature curing
Creative Materials Inc.
Creative Materials 124-24
Ready to Use Product Type:
Conductive Adhesive
Cure Method:
Radiation Cure
Compatible Substrates & Surfaces:
Polyimide, Plastics, Glass
Application Method:
Screen Coating
Chemical Family:
Acrylics & Acrylates
124-24 is a screen-printable, anisotropic, UV cured adhesive. This product can be used on a variety of substrates such as polycarbonate, treated and untreated polyesters, Kapton, epoxy/glass PC boards and glass.Features UV curable flexible adhesive
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