- Applications:Semiconductor Manufacturing, Appliances & Electronics, Adhesives & Sealants
- Product Families:Other Adhesives & Sealants, Adhesives & Sealants
RTK7659 is a tack-film, reworkable, diamond-filled, epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier. This B-Staged, dielectric adhesive offers excellent reworkability at 80-150°C. RTK7659 has excellent thermal conductivity and the low Tg of the adhesiveimposes minimum thermal stress on bonded parts during thermal cycling or shock testing.