- Applications:Semiconductor Manufacturing, Adhesives & Sealants, Appliances & Electronics
- Product Families:Conductive Adhesives, Adhesives & Sealants
- Chemical Family:Epoxy & Epoxy Derivatives
ESP8450-WL is a high melt-flow version of standard ESP8450 designed for large area bonding and wafer-level lamination for stack-chip applications. It is a solvent resistant, silver-filled, flexible epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier. This novel, B-staged electrically conductive adhesive offers excellent flexibility from-55°C to 150°C. The dry, tack-free handling of the film makes it ideal for an automated pick and place assembly and is reworkable from 80°C to 150°C. ESP8450-WL has excellent thermal conductivity and its low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or shock testing.