Products in Potting Compounds

127-31 is an extremely flexible one-component, syringe dispensable, 100% solids, thermally conductive, electrically insulating soft epoxy adhesive, encapsulant, and potting compound. This system features excellent thermal stability, chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 127-31 features a low durometer and is highly flexible allowing it to absorb stress when bonding mismatched CTE substrates. 127-31 even displays some elastomeric properties. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding.Features Elastomeric Flexible thermally conductive adhesive/potting compound

The 811-64 System is a two component, high performance, room temperature curing, highly filled potting / encapsulating compound. 811-64 is the carbon filled version of 812-48.FeaturesTwo component, high performance, exhibits exceptional wetting and void free during pouring, with low shrinkage.

102-12 is a black, two component thermally conductive epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 102-12 is an improved, crack-resistant version of F947. Use with standard Part B for room temperature cure.FeaturesThermal cycle resistantBlack, epoxy compound.Room temperature cureImproved crack resistanceHigh thermal conductivity

108-50MG is a one component, thermally conductive, low stress, low shrink potting compound and adhesive. 108-50MG features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring Class "F" service temperature rating. 108-50MG can also be used as an adhesive for bonding stress sensitive substrates when low ionics or low hydrolyzable chloride is required. 108- 50MG is a microelectronics grade version of 108-50.Features Microelectronics grade Low stress Moderate thermally conductive adhesive/potting compound

The 810-44-2 System is a two component (A + B) high performance, thermally conductive, room temperature curing epoxy adhesive and potting compound. This is a higher viscosity version of 810-44.FeaturesTwo component, low CTE, low flow epoxy adhesive.

113-33 is a sag resistant black, flame-out, two component, epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 113-33 is an improved, sag resistant version of 102-11.FeaturesSame as above, but extended pot life; better resistance to thermal cracking.

Black Flexible Epoxy, Encapsulating & Potting Compound 832FX is a black, 2-part, flexible epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where minimizing the physical stress on components is critical. It performs well in low temperature and arctic environments, as well as applications that involve temperature cycling or rapid temperature changes. It provides the functionality of silicone, but with the durability and cost-effectiveness of epoxy.

High Thermal Conductivity Epoxy, Encapsulating & Potting Compound 834HTC is a 2-part, black, rigid, flameretardant thermal epoxy that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This epoxy resin is designed for applications where thermal management and selfextinguishing are critical. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

834B potting and encapsulating compound is a black, flame retardant, thermally conductive two-part epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where thermal management and self-extinguishing are critical. It also provides excellent electrical insulation and protects components from static discharges, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals. This epoxy has a convenient 2:1 volume mix ratio, making it compatible with most dispensing equipment. 834B can be cured at room temperature or higher.

High Temperature Epoxy, Encapsulating & Potting Compound 832HT is a general purpose, rigid, black, 2-part high temperature epoxy that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. It is useful when extreme physical strength and chemical resistance are required. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

Black 1:1 Epoxy, Encapsulating & Potting Compound 832HD is a black, rigid, 2-part epoxy that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Due to its low mixed viscosity, 832HD can easily penetrate small gaps and cavities. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

Thermally Conductive Epoxy, Encapsulating & Potting Compound 832TC is a 2-part, black epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. It is designed for applications where thermal management is a concern. Its high thermal conductivity helps protect circuits by reducing the risk of heat buildup. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

Translucent Epoxy, Encapsulating & Potting Compound 832C is a rigid, amber clear epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Due to its low mixed viscosity, it can easily penetrate small gaps and cavities. It also provides excellent electrical insulation and protects components from static discharges, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

Black Flexible Epoxy, Encapsulating & Potting Compound 834FX is a 2-part, flame-retardant, thermally conductive, fexible epoxy resin that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where minimizing the physical stress on components is critical. It is good in low temperature and arctic environments, and in applications that involve temperature cycling or rapid temperature changes. It provides the functionality of silicone, but with the durability and cost-effectiveness of epoxy.

832WC is a rigid, 2-part, clear epoxy resin that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. It is designed for applications where high clarity is required. It does not yellow when exposed to UV light; it maintains clarity in applications with service temperatures of up to 65 °C and intermittent exposures of up to 100 °C. It can be used for underwater applications such as potting swimming pool lights. It is also a good choice for casting resin.

EC-1030FL is a 2 component, flexible, high temperature epoxy potting compound. EC-1030FL offers an open work time at room temperature and cures at elevated temperatures. EC-1030FL can withstand temperatures of over 175°C and stays flexible at very low temperatures.

BD5460 is a two-part, epoxy hybrid room temperature cure adhesive designed industrial bonding, small potting and laminating where excellent strength and toughness, structural bonding, and mechanical and electrical properties are required. This 2-part adhesive cures at room temperature, exhibits good wetting, and develops high strength, low shrink bonds to most materials including fiberglass, ceramics, metals and many plastics. It has great dimensional stability over a wide range of temperatures. Fully cured bd5420 is a durable electrical insulator with resistance to water, weather, ozone and oxygen, various solvents, fuels, oils, alcohols, mild acids and alkalis and many other organic compounds including diesel fuel and gasoline. It is especially formulated for a 2:1 mix ratio for use in side by side cartridges, or to be used by hand mixing, or use with meter mix equipment. A handling cure is normally achieved at room temperature within 120 minutes with a full cure at room temperature within 24 hours. To accelerate the final cure, or to quicken the handling simply elevate the temperature.

102-11 is a black, flame-out, two component, epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure resulting in a smooth, pinhole free surface. 102-11 is an improved, crack-resistant version of F947.Features Crack resistant, black, flame-out, epoxy compound. Room temperature cure, improved resistance to thermal cycling. Other properties similar to F947A/B.

102-11/B187 is a black, flame-out, two component, epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 102-11 is an improved, crack resistance version of F947.Features Excellent resistance to thermal shock Longer pot life. Requires mild heat cure.

Black Epoxy, Encapsulating & Potting Compound 832B is a general purpose, rigid, 2-part black epoxy that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Due to its low mixed viscosity, 832B can easily penetrate small gaps and cavities. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

One-part Epoxy Potting Compound 9510 is a black, rigid, one-part epoxy potting compound. It is a heat cure epoxy that provides unlimited working time at room temperature and does not require frozen storage. Our 1-part epoxy resin provides exceptional chemical resistance against a wide variety of mild to harsh chemicals, including toluene, acetone and ethyl acetate. It also provides excellent electrical insulation and protects against static discharge, vibration, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

Black Flexible Urethane 8800 is a black, 2-part, flexible polyurethane resin. It has a low mixed viscosity and maintains excellent flexibility at low temperatures. In addition, this flexible urethane adheres strongly to a wide variety of substrates, including metals, composites, glass, ceramics, and many plastics. It is a cost-effective flexible potting option that provides exceptional physical protection and creates minimum stress on circuit boards and surface-mounted devices. It offers superior moisture resistance and is an ideal choice for harsh environments, especially saltwater exposure and marine applications.

8810 urethane resin is a black, tough, 2-part potting compound. It features a low mixed viscosity and excellent moisture resistance. In addition, this rigid urethane potting compound adheres strongly to a wide variety of substrates, including metals, composites, glass, ceramics, and many plastics. This 2-part polyurethane resin offers exceptional physical protection and is designed for potting and encapsulating intricate electronic components and cable jointing boxes.

High Temperature Rigid Urethane 8820 is a black, tough, high temperature, two-part polyurethane potting compound. It has a low mixed viscosity and properties similar to epoxy compounds, but with exceptional low temperature stability. As well, it adheres strongly to a wide variety of substrates, including metals, composites, glass, ceramics, and many plastics. 8820 offers exceptional physical protection, a high continuous operating temperature, and superior protection from acids, bases, and many organic solvents.

UB-907FL is a two-component, industrial grade polyurethane adhesive system. Once cured, it forms a highly flexible bond line which provides peel and shear strength. It is deal for bonding a variety of metals, as well as plastics, glass, wood, and more. Can also be used for potting and encapsulating strain and heat sensitive electronic components.

SC-550-LV-RT is a 100% silicone solid elastomer designed for electronic potting applications. This two-component, room temperature curing system offers a hard, self-bonding, thermally conductive, low modulus material that is readily re-workable.

SC-454M-6 is a thermally conductive, low viscosity, condensation cure, RTV silicone potting or encapsulating compound. It is readily pourable and can cure at room temperature. The cured resin has a very good flexibility with excellent electrical properties and high temperature resistance.

SC-550-LV-TC-1 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-1 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.

SC-550-LV-TC-2 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-2 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.

UV-8403 is a low viscosity, light curing epoxy adhesive that bonds well to a wide variety of substrates including engineered plastics such as UltemTM, LexanTM, and ABS. This product exhibits good surface wetting and adhesion to glass and many plastics. UV-8403 cures to a clear polymer when properly cured. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of UVA light (310-365nm).

UV-8311 is a low viscosity, fast curing, light curing epoxy adhesive that offers excellent strenth wetting properties. UV-8311 cures to a high Tg, rigid polymer with excellent adhesive to metals, ceramics, and glass.This product requires direct light exposure during cure. UV-8311 can cure fully in under 10 seconds using optimal cure conditions. Due to the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cures best in the UVA wavelengths

SC-417 is a two-part, low viscosity, clear silicone which will cure at room temperature or at elevated temperatures. The cured elastomer is suited for electrical/electronic potting and encapsulating applications and provides environmental protection. It is readily pourable and can cure from room temperature to 200°C. The cured resin has a very good flexibility with excellent electrical properties and high temperature resistance.

Andisil® crosslinkers and chain extenders are reactive silicon-hydride containing polysiloxanes that can be used in addition cure systems with Andisil® VS polymers or Andisil® Reactive Methyl Phenyl polymers and a Andisil® platinum catalyst. They are available in various viscosities and silicon-hydride contents.

Andisil® crosslinkers and chain extenders are reactive silicon-hydride containing polysiloxanes that can be used in addition cure systems with Andisil® VS polymers or Andisil® Reactive Methyl Phenyl polymers and a Andisil® platinum catalyst. They are available in various viscosities and silicon-hydride contents.

Andisil® crosslinkers and chain extenders are reactive silicon-hydride containing polysiloxanes that can be used in addition cure systems with Andisil® VS polymers or Andisil® Reactive Methyl Phenyl polymers and a Andisil® platinum catalyst. They are available in various viscosities and silicon-hydride contents.