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309 Products found in Epoxies

Epoxy Curing Agent ECA 29 banner
Knowde company logo
HuntsmanEpoxy Curing Agent ECA 29
  • Chemical Family:Epoxy & Epoxy Derivatives

Epoxy Curing Agent ECA 29 is a mixture of aliphatic polyamines derived from ethylenediamine and has an AHEW (amine-hydrogen equivalent weight) in the range of 36-38. Consisting of higher oligomers of TETA (triethylenetetramine), Epoxy Curing Agent ECA 29 amine may be particularly useful as an epoxy curing agent in applications where higher Tg (glass transition temperature) and reasonably fast reactivity are needed with longer pot-life than DETA or TETA hardeners. As illustrated by the following figure, the increasingly fast gel times with standard bisphenol A based epoxies of the ethyleneamine series EDA (AHEW = 15.03), DETA (AHEW = 20.6), and TETA (AHEW = 24.4) are attributable to their increasing functionality and to them being aliphatic amines. For these three amines, the gel times shorten through the series, even though their AHEWs are increasing, which decreases the concentration of reactants in stoichiometric mixtures. As might be expected, the amines with higher AHEW, and therefore lower amine group concentrations in the formulations, have somewhat lower maximum exotherm temperatures. Epoxy Curing Agent ECA 29 amine follows this trend of having a slightly lower exotherm temperature, however it provides a longer working time until gelation than do the lower functionality amines DETA or TETA. This is attributed to the higher proportion of secondary amino groups in this product. The high functionality of this amine also increases the level of crosslinking in the fully cured epoxy, resulting in a relatively high Tg of 143°C.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

EPALLOY® 5000 banner
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HuntsmanEPALLOY® 5000
  • Chemical Name:Hydrogenated bisphenol-A epoxy resin
  • CAS Number:30583-72-3
  • Chemical Family:Epoxy & Epoxy Derivatives
  • Labeling Claims:Isocyanates-free, Volatile Organic Compound-free, Substances of Very High Concern Chemicals-free

EPALLOY® 5000 resin is the diepoxide of the hydrogenated bisphenol A. Due to its saturated ring structure, this resin will find utility in applications requiring resistance to ultraviolet light exposure. Formulations based on standard DGEBA resins usually do not perform well in this environment. Curing agent selection should be done with great care to achieve optimum weathering resistance with EPALLOY® 5000 resin. Products with improved chalking resistance and gloss retention can be formulated. EPALLOY® 5000 resin exhibits a significantly lower viscosity than DGEBA. Higher filler loadings can, therefore, be achieved, resulting in cost reduction and reduced shrinkage. The adhesion and chemical resistance characteristics of EPALLOY® 5000 resin formulations are expected to be like those of standard DGEBA systems.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

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