Products

SABIC's Specialties Business LNP™ THERMOCOMP™ LX08411 compound is based on Polyetheretherketone (PEEK) resin containing 45% carbon fiber. Added features of this grade include: Electrically Conductive, High Modulus, Easy Molding.

SABIC's Specialties Business LNP THERMOCOMP OCF62E compound is based on linear Polyphenylene Sulfide (PPS) resin containing 10% carbon fiber, 30% glass fiber. Added features of this grade include: Electrically Conductive, Easy Molding This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP EC006E compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive.

SABIC's Specialties Business LNP™ THERMOCOMP™ EC006AQW compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive. This grade has been pre-assessed and passed the material related tests from the ISO 10993 “Biological Evaluation of Medical Devices”.

SABIC's Specialties Business LNP THERMOCOMP LC004XXP compound is based on Polyetheretherketone (PEEK) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP EC006APQ compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, High Flow, FAR25.853 Compliant. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP 2C003 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP LX03447 compound is based on Polyetheretherketone (PEEK) resin containing 35% carbon fiber. Added features of this grade include: Electrically Conductive.

SABIC's Specialties Business LNP™ THERMOCOMP™ LC00AEX1 compound is based on Polyetheretherketone (PEEK) resin containing 50% carbon fiber. Added features of this grade include: Electrically Conductive, Ultra High Modulus and Strength, Easy Molding, Excellent Wear Resistance and Low CTE.

SABIC's Specialties Business LNP™ THERMOCOMP™ LC006EX1 compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: High Modulus, High impact, Easy Molding, Electrical Conductive.

LNP THERMOCOMP 2C004 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.

SABIC's Specialties Business LNP THERMOCOMP EC004XXC compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP OC006 compound is based on linear Polyphenylene Sulfide (PPS) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP LC008E compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP LC00APXQ compound is based on Polyetheretherketone (PEEK) resin containing 50% carbon fiber. Added features of this grade include: Exceptional Processing, Electrically Conductive.

LNP™ THERMOCOMP™ Compound 5C003 is a Polyvinylidene Fluoride (PVDF) resin-based compound with 15% carbon fiber, offering electrically conductive properties. It is characterized by its high stiffness and strength, making it ideal for applications in electrical and electronics, energy management, electronic components, and industrial material handling. This compound is processed through injection molding.

SABIC's Specialties Business LNP THERMOCOMP LC006 compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP EC008 compound is based on Polyetherimide (PEI) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP LC008EXQ compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.

SABIC's Specialties Business LNP THERMOCOMP LX09404 compound is based on Polyetheretherketone (PEEK) resin containing 45% carbon fiber. Added features of this grade include: Electrically Conductive, High Modulus This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP ECF62 compound is based on Polyetherimide (PEI) resin containing 30% glass fiber, 10% carbon fiber. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP 2X04505 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.

SABIC's Specialties Business LNP THERMOCOMP EC005 compound is based on Polyetherimide (PEI) resin containing 25% carbon fiber. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP LC008EXP compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.

SABIC's Specialties Business LNP™ THERMOCOMP™ EC006PXQ compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, Exceptional Processing, FAR25.853 Compliant.

LNP THERMOCOMP 2X98703 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.

SABIC's Specialties Business LNP THERMOCOMP EX93452 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP EX11414 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive, FAR25.853 Compliant.

LNP THERMOCOMP LX04015 compound is based on Polyetheretherketone (PEEK) resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.

LNP THERMOCOMP LC003E compound is based on Polyetheretherketone (PEEK) resin containing 15% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive

SABIC's Specialties Business LNP THERMOCOMP EC008PXQ compound is based on Polyetherimide (PEI) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Exceptional Processing, FAR25.853 Compliant. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP EC006 compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP 9X99089 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP EC004APQ compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive, FAR25.853 Compliant. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP™ THERMOCOMP™ EC008APQ compound is based on Polyetherimide (PEI) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, High Flow. FAR25.853 Compliant.

LNP THERMOCOMP LC006EXQ compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.