Products

COOL SILVER™ G4 is the fourth generation and a lower themal resistance version of the famed COOL-SILVER grease. It is a non-curing, non- silicone, thermal interface grease that is not electrically conductive. The non-curing COOL SILVER™ G4 is by far the lowest thermal resistance grease that is not electrically conductive. It is designed specifically for high power devices requiring less than 0.0016 °C-in/watt thermal resistance (0.001 inch interface layer). COOL SILVER™ G4 will become slightly more viscous after dispensing. It will remain a thermaly conductive interface medium with non-electrically conductive properties.

ME 8630-SSC is a ultra-fast curing with extra fine silver filled for finer pitch application. It is a low stress, low temperature curable die-attach adhesive paste. This single component, silver filled paste is electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The relatively medium Tg and modulus made it suitable for bonding both smaller and relatively large devices. Wire-bonding at temperatures as high as 250°C is easily achievable. ME 8630-SSC has been designed to eliminate bleeding on both silver plated copper and alloy 42 leadframes.

ME 8418-SC is a rapid curing version of ME 8418-FP-LV. This silver filled paste is solvent free, electrically and thermally conductive. It is designed for automated, online die attach processing.

ME7656 is a reworkable, boron-nitride crystallite filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The very high thermal conductivity of this material makes it useful for bonding high- powered, large area die and components.

ME8456 is a reworkable, pure silver filled, electrically and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). It can be readily reworked from 80 to 100°C and is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE's. Meets Mil-Std 883; Method 5011.5 and NASA-ESA Outgassing Requirements.

SR8850-1 is a room temperature curable, silver coated copper filled, electrically conductive RTV silicone sealant/adhesive. It can be used as a coating if dissolved or diluted with low boiling point solvent, such as naphtha. The material has no corrosive by-products and has good adhesion properties to metals, plastics, silicones, ceramics and glass. It is useful for bonding large area substrates and components of any size. The material is provided as a one-part electrically conductive elastomer/silicone with a compatible primer. The silicone cures when exposed to atmospheric conditions. The typical curing schedule is 24 hours at 25°C and 60% relative humidity. Using a large volume of paste requires a cure schedule of 48 hours at 25°C and 60% relative humidity.

CC7130-PRTC is a low viscosity version of CC7130-PR for thin coating. It is a translucent coating liquid. It provides excellent protection for electronic components and devices that are highly sensitive to moisture. CC7130 PRTC, coated on PCB, provides more than 200 giga-ohm resistance at 1000 volt even when the board is in direct contact with salt water. It protects PCB to 1000 volt even after prolong exposure to 85CI85% humidity. In accelerated aging test, submerging in 5 wt% salt waters at 60°C, it protects copper surfaces for >24 hours. It is flexible to withstand extreme temperature cycles in Outdoor environment. CC7130-PRTC can easily be dispensed using conventional tools without vacuum deposition equipment. Compared to acrylic or urethane materials, CC7130-PRTC material has low moisture absorption and low moisture transmission rate.

ME7155-AN is a reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components. It can be readily reworked at 80-100°C.

ME 7650-RC is a low viscosity version of ME7150 for snap curing applications. It is a reworkable, unfilled, electrically insulating, and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The stress-free flexible characteristic of this material makes it useful for bonding high-powered, large area dies and components. ME 7650-RC can be cured rapidly at 150-180°C for approximately 60 seconds without creating voids. It can be readily reworked at 80-100°C.

ME8630-RC is an extra fine silver filled 100% solid rapid curing die- attach for finer pitch application. It is a low stress, low temperature curable die-attach adhesive paste. This single component, silver filled paste is electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The relatively medium Tg and modulus made it suitable for bonding both smaller and relatively large devices. ME8630-RC has been designed to eliminate bleeding on both silver plated copper and alloy 42 lead frames. It maintains more than 150 psi bond strength at 250°C for high temperature wire-bonding.

ME7155 is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits not only outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper), but also exhibits high level of uniformity and consistency in appearance and smoothness of texture, yielding potential ease of use and success in applications. The high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components. MEZ155 can be readily reworked at 80-1502.

EG8020 is a two-part, silver filled, room temperature curable adhesive upon mixing. This paste has good bond strength and is both electrically and thermally conductive. The easy mix ratio of 1:1 by weight or volume and ambient curable with long pot-life enable the adhesive to be used for small volume field and larger volume production applications.

ME8512 is designed for automated, inline processing. This single component, silver filled paste is solvent free, electrically and thermally conductive. It is highly thixotropic with minimal sag. ME8512 has been designed to eliminate bleeding on both silver plated copper and alloy 42 leadframes.