Products in Adhesives & Sealants

8329TCM is a 2-part thermally conductive epoxy adhesive. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This adhesive is most often used as heatsink glue, attaching heatsinks to CPUs, LEDs, or other heat generating electronics components. This compound has been formulated for high thermal conductivity. It is highly viscous and must be mixed by hand prior to application. For a lower viscosity use 8349TFM. For a shorter working time, use 8349TFM. For a longer working time, use 8329TCS.

8810 urethane resin is a black, tough, 2-part potting compound. It features a low mixed viscosity and excellent moisture resistance. In addition, this rigid urethane potting compound adheres strongly to a wide variety of substrates, including metals, composites, glass, ceramics, and many plastics. This 2-part polyurethane resin offers exceptional physical protection and is designed for potting and encapsulating intricate electronic components and cable jointing boxes.

9460TC is a 1-part, heat cured only, thermally conductive epoxy adhesive with an unlimited working time. It is an off-white, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This 1-part adhesive is used to glue heat sinks to LEDs, CPUs and other heat-generating components. It does not require mixing and is suitable for use with manual, pneumatic, and automatic dispensing systems.

8331 is an electrically conductive, silver-filled 2-part epoxy adhesive. It is smooth, non-sagging, thixotropic, and bonds well to a wide variety of substrates. This product allows for quick, cold-soldering repairs. It can also be used as a solder replacement for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. 8331 has been formulated to be economical. For a higher fill that maximizes conductivity, use 8330. For a longer working time, use 8331S.

8329TCF is a thermally conductive, fast-cure two-part epoxy adhesive. It is off-white, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates. It is also flame retardant and meets the UL 94V-0 standard. For a 1 mL quantity, a minimal service cure can be achieved in 15 minutes at room temperature, and a full cure in 4 hours. This product is used to bond heat sinks, LEDs and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips and automatic dispensing systems. 8329TCF has been designed for maximum thermal conductivity with a high viscosity. For a lower viscosity, use 8329TFF. For a longer working life, use 8329TCM or 8329TCS.

RTV5810 series sealants are neutral cure, one-component, ready-to-use silicone adhesive sealants that cure to tough resilient silicone rubber on exposure to atmospheric moisture at room temperature. These sealants are fast curing, paste consistency products that may be considered for use where quick initial adhesion build is desired. This may allow for movement of the sealed assemblies in a shorter period of time, increasing productivity.

RTV167 adhesive sealants from Momentive Performance Materials are one-component, ready-to-use electronic grade silicone sealants. They cure to a tough, resilient silicone rubber on exposure to atmospheric moisture at room temperature. These electronic-grade silicone adhesive sealants differ somewhat in physical properties including consistency.

8329TCS is a 2-part, heat-cure, thermally conductive epoxy adhesive with a 4-hour working time. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal adhesive is used to glue heat sinks to LEDs, CPUs and other heat-generating components. 8329TCS has been designed for maximum thermal conductivity. It is highly viscous and must be mixed by hand prior to application. For a lower viscosity, use 8329TFS. For a shorter working time, use 8329TCM.

9410 is a 1-part electrically conductive epoxy adhesive. It has unlimited working time at room temperature. It bonds well to a wide variety of substrates, and offers strong chemical resistance. 9410 is designed for semi-conductor flip chip packaging as well as die attach for small chips, LEDs and diodes. It provides excellent EMI/RFI shielding and is very effective at filling in seams between metal plates. It can be readily used in manual, pneumatic and robotic dispensing processes.

RTV108 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. RTV102, RTV103, RTV106, RTV108, RTV109, RTV112, RTV116 and RTV118 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. Since all these sealants utilize a moisture cure system, they must not be used in thicknesses of greater than 6mm (1/4 in.). Where section depths exceed 6mm (1/4 in.), Momentive Performance Materials one component, addition cure or two-component silicone rubber compounds are recommended.

High Temperature Rigid Urethane 8820 is a black, tough, high temperature, two-part polyurethane potting compound. It has a low mixed viscosity and properties similar to epoxy compounds, but with exceptional low temperature stability. As well, it adheres strongly to a wide variety of substrates, including metals, composites, glass, ceramics, and many plastics. 8820 offers exceptional physical protection, a high continuous operating temperature, and superior protection from acids, bases, and many organic solvents.

Dry Cell Battery Sealant

Dry Cell Battery Sealant

Dry Cell Battery Sealant

Dry Cell Battery Sealant

Dry Cell Battery Sealant

Andisil® SPR 2833 Clear is a reactive silicone primer that can be used to improve adhesion of various RTV silicones to a variety of substrates including: metal, wood, glass, ceramics and many plastics. It is useful in formulations where a clear primer is preferred.

SC-454M-6 is a thermally conductive, low viscosity, condensation cure, RTV silicone potting or encapsulating compound. It is readily pourable and can cure at room temperature. The cured resin has a very good flexibility with excellent electrical properties and high temperature resistance.

UB-907FL is a two-component, industrial grade polyurethane adhesive system. Once cured, it forms a highly flexible bond line which provides peel and shear strength. It is deal for bonding a variety of metals, as well as plastics, glass, wood, and more. Can also be used for potting and encapsulating strain and heat sensitive electronic components.

SC-550-LV-TC-2 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-2 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.

UV-8403 is a low viscosity, light curing epoxy adhesive that bonds well to a wide variety of substrates including engineered plastics such as UltemTM, LexanTM, and ABS. This product exhibits good surface wetting and adhesion to glass and many plastics. UV-8403 cures to a clear polymer when properly cured. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of UVA light (310-365nm).

UV-5403S is a filled, low shrinkage, light curing epoxy adhesive that offers low CTE and high bonds strength. UV-5403S cures to a high bond strength polymer with excellent adhesive to metals, ceramics, and glass. This epoxy was specifically designed as a glob top encapsulant for smart card applications and encapsulations of chip modules. UV-5403S is free of solvents, has high ionic purity, and is resistant to moisture and humidity. This epoxy cures quickly under LED and UVA light.

UV-8311 is a low viscosity, fast curing, light curing epoxy adhesive that offers excellent strenth wetting properties. UV-8311 cures to a high Tg, rigid polymer with excellent adhesive to metals, ceramics, and glass.This product requires direct light exposure during cure. UV-8311 can cure fully in under 10 seconds using optimal cure conditions. Due to the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cures best in the UVA wavelengths

SC-550-LV-TC-1 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-1 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.

SC-550-LV-RT is a 100% silicone solid elastomer designed for electronic potting applications. This two-component, room temperature curing system offers a hard, self-bonding, thermally conductive, low modulus material that is readily re-workable.

SC-417 is a two-part, low viscosity, clear silicone which will cure at room temperature or at elevated temperatures. The cured elastomer is suited for electrical/electronic potting and encapsulating applications and provides environmental protection. It is readily pourable and can cure from room temperature to 200°C. The cured resin has a very good flexibility with excellent electrical properties and high temperature resistance.

Turbo Fuse 110 ME, Methyl metal cyanoacrylate adhesive is designed to polymerize instantly by absorbing surface moisture. This cyanoacrylate adhesive is specifically formulated to bond various metals including aluminum, stainless steel, and copper, to itself and to a variety of materials including wood, balsa wood, rubber, plastics and leather.

ME7635-RC is an thermally conductive insulating epoxy adhesive for die-attach applications. This thixotropic paste is solvent free. It is designed for automated, inline bonding processing ME7635-RC is low in ionic impurities (<60 ppm total) and meets all requirements for MIL-Std 883D 5011.4 specification for dielectric adhesive. Fast curing can be achieved from 80°C and higher temperatures.

FLASHBOND™ UV-3700F is a filled, low shrinkage, light curing epoxy adhesive that offers low CTE and high bonds strength. UV-3700F cures to a high Tg, rigid polymer with excellent adhesive to metals, ceramics, and glass. This filled system is excellent for when low viscosity systems are not ideal. Due to the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (400- 415nm).

Bomar™ BR-641D is a Polybutadiene (PBD) urethane acrylate, which was designed to meet rigorous electronic coating applications. This oligomer has exceptional adhesion to various metals, glass,and polycarbonate substrates. BR-641D has many desirable properties that are typical to PBD resins, combined with radiation curability. In applications requiring thermal cycling resistance, BR-641D withstands the extremes of temperature typical of such tests, without undue degradation of properties. In addition to the adhesion properties listed in the table below, BR-641D showed excellent adhesion to PMMA, ABS, PVC, Nylon-6, Polystyrene,and Polypropylene.

Turbo Fuse Series 160 SI advanced formula is designed to polymerize instantly by absorbing surface moisture. The product's performance has been tested with a variety of materials, and is recommended for a multitude of applications. The fast curing qualities make it especially desirable in high speed industrial production. Turbo Fuse Series 160 SI is ideal for use in applications that require an easily handled high viscosity adhesive. This formula is widely used in the Aerospace, Automotive and Electronic industries.

EG8050-LV is an electrically conductive, silver filled epoxy which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). It can be readily reworked at 80-150°C and is ideal for applications such as large area die attach and substrate attach because of it's ability to bond materials with highly mismatched CTE.

CGSTAPE - 7659 is a CM polyimide film formed by sputtering metal aluminum, then develops thin aluminum layer, with one side insulation, the other side high conduct electricity. It not only has the performance of excellent heat resistant, mechanical, chemical stability, radiation resistant, and self-extinguishing, but also emi shielding, high thermal conductivity. Now we have HN polyimide film sputtering aluminum and black polyimide film sputtering aluminum.

STG-40 is a non-reactive, Silicone, Thermally Conductive Grease with a high thermal conductivity and low thermal resistance with a soft, non-flowable consistency. This product is formulated with specialty binding agents to achieve lowest amount of bleed and evaporations. It is designed for applications where a silicone thermal interface material is required and where the device may later need to be easily removed from the heat sink. This compound is ideally suited for use in thin cross-sectional thicknesses down to ≤1 mil.