Products results

EB-430-1HT is a highly versatile epoxy adhesive formulated for semiconductor industry. An easy to dispense liquid paste, it offers high heat transfer, low shrinkage and a coefficient of thermal expansion comparable to that of copper and aluminum. This adhesive is designed for protecting IC's in TAB, as well as glob-top encapsulant for COB placement. Other applications include fabricating heat sinks, bonding semiconductors and transistors to heat sinks and general-purpose bonding of electronic components.

UC-2356 is a two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows for easy flow and air release and excellent hydrolytic stability. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.

EC-1009 is a pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

UB-50 is a clear, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release. The cured elastomer has excellent bond to metals, ceramics, and many plastics used in medical industry such as acrylic, polycarbonate, PVC etc. They also have excellent water resistance, and are exceptionally resistant to thermal shock. They can be used as an adhesive or for potting, casting and encapsulating applications.

EC-1012MFR-HT is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

EC-1015 is a low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.

EC-1012M/EH-20M is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

EC-1006M-4 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.

EC-1850FT with EH-10E Hardener is a very low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.

UXP-052107-1 is a filled, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release.

UC-2521 is a filled, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.

EPOXICAST-1006/EH-24 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. The cured system provides excellent resistance to moisture, most organic solvents and inorganic chemicals.

UC-2350 is a two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows for easy flow and air release and excellent hydrolytic stability. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.

UC-2524 is a filled, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.

113-33 is a sag resistant black, flame-out, two component, epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 113-33 is an improved, sag resistant version of 102-11.FeaturesSame as above, but extended pot life; better resistance to thermal cracking.

The 810-44-2 System is a two component (A + B) high performance, thermally conductive, room temperature curing epoxy adhesive and potting compound. This is a higher viscosity version of 810-44.FeaturesTwo component, low CTE, low flow epoxy adhesive.

904-64 is a two-component, thermally conductive, red, high performance room temperature addition curing siliconeFeaturesTwo component, easy air release and low shrinkage addition cured silicone potting compound

102-12 is a black, two component thermally conductive epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 102-12 is an improved, crack-resistant version of F947. Use with standard Part B for room temperature cure.FeaturesThermal cycle resistantBlack, epoxy compound.Room temperature cureImproved crack resistanceHigh thermal conductivity

102-12/B-187 is a black, two component, thermally conductive epoxy potting and encapsulating compound. This product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 102-12/B-187 exhibits excellent thermal shock resistance and is especially suited to protecting sensitive electronic devices from a range of operating conditions including moisture, vibration, and temperature variation. Other useful applications include, but are not limited to, potting relays, electronic controls, sensors, and inverters and sealing of electronic component housings. Using B-187 allows for faster curing compared to B119-44.FeaturesSame as above, but extended pot life; better resistance to thermal cracking.

The 811-64 System is a two component, high performance, room temperature curing, highly filled potting / encapsulating compound. 811-64 is the carbon filled version of 812-48.FeaturesTwo component, high performance, exhibits exceptional wetting and void free during pouring, with low shrinkage.

Translucent Epoxy, Encapsulating & Potting Compound 832C is a rigid, amber clear epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Due to its low mixed viscosity, it can easily penetrate small gaps and cavities. It also provides excellent electrical insulation and protects components from static discharges, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

Black 1:1 Epoxy, Encapsulating & Potting Compound 832HD is a black, rigid, 2-part epoxy that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Due to its low mixed viscosity, 832HD can easily penetrate small gaps and cavities. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

Black Flexible Epoxy, Encapsulating & Potting Compound 834FX is a 2-part, flame-retardant, thermally conductive, fexible epoxy resin that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where minimizing the physical stress on components is critical. It is good in low temperature and arctic environments, and in applications that involve temperature cycling or rapid temperature changes. It provides the functionality of silicone, but with the durability and cost-effectiveness of epoxy.

Thermally Conductive Epoxy, Encapsulating & Potting Compound 832TC is a 2-part, black epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. It is designed for applications where thermal management is a concern. Its high thermal conductivity helps protect circuits by reducing the risk of heat buildup. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

Black Flexible Epoxy, Encapsulating & Potting Compound 832FX is a black, 2-part, flexible epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where minimizing the physical stress on components is critical. It performs well in low temperature and arctic environments, as well as applications that involve temperature cycling or rapid temperature changes. It provides the functionality of silicone, but with the durability and cost-effectiveness of epoxy.

High Thermal Conductivity Epoxy, Encapsulating & Potting Compound 834HTC is a 2-part, black, rigid, flameretardant thermal epoxy that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This epoxy resin is designed for applications where thermal management and selfextinguishing are critical. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

834B potting and encapsulating compound is a black, flame retardant, thermally conductive two-part epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where thermal management and self-extinguishing are critical. It also provides excellent electrical insulation and protects components from static discharges, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals. This epoxy has a convenient 2:1 volume mix ratio, making it compatible with most dispensing equipment. 834B can be cured at room temperature or higher.

High Temperature Epoxy, Encapsulating & Potting Compound 832HT is a general purpose, rigid, black, 2-part high temperature epoxy that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. It is useful when extreme physical strength and chemical resistance are required. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

832WC is a rigid, 2-part, clear epoxy resin that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. It is designed for applications where high clarity is required. It does not yellow when exposed to UV light; it maintains clarity in applications with service temperatures of up to 65 °C and intermittent exposures of up to 100 °C. It can be used for underwater applications such as potting swimming pool lights. It is also a good choice for casting resin.

EC-1030FL is a 2 component, flexible, high temperature epoxy potting compound. EC-1030FL offers an open work time at room temperature and cures at elevated temperatures. EC-1030FL can withstand temperatures of over 175°C and stays flexible at very low temperatures.

102-11 is a black, flame-out, two component, epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure resulting in a smooth, pinhole free surface. 102-11 is an improved, crack-resistant version of F947.Features Crack resistant, black, flame-out, epoxy compound. Room temperature cure, improved resistance to thermal cycling. Other properties similar to F947A/B.

Noelle 908-61 System is a medium hardness, gray, two components (A+B), high performance filled, room temperature or heat curing system. Noelle 908-61 System is designed for use in applications that requires a highly thermally conductive, shock resident, and cushion coat material for sensitive or fragile components or fine electrical wires.Features Two component gray thermally conductive silicone

102-11/B187 is a black, flame-out, two component, epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 102-11 is an improved, crack resistance version of F947.Features Excellent resistance to thermal shock Longer pot life. Requires mild heat cure.

Black Epoxy, Encapsulating & Potting Compound 832B is a general purpose, rigid, 2-part black epoxy that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Due to its low mixed viscosity, 832B can easily penetrate small gaps and cavities. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

RTV102 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. RTV102, RTV103, RTV106, RTV108, RTV109, RTV112, RTV116 and RTV118 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. Since all these sealants utilize a moisture cure system, they must not be used in thicknesses of greater than 6mm (1/4 in.). Where section depths exceed 6mm (1/4 in.), Momentive Performance Materials one component, addition cure or two-component silicone rubber compounds are recommended.

9200 is a toughened, 2-part epoxy adhesive, designed to create long-lasting load-bearing joints. It creates tough vibration-resistant bonds and is especially useful for joining dissimilar materials that will experience thermal cycling stresses or harsh environmental conditions. This smooth, non-sagging, thixotropic adhesive is excellent for use on vertical surfaces, for gap filling, and for potting electronics enclosures with gaps where a non-thixotropic encapsulant would flow through. For a flame retardant version, use 9200FR.