- Applications:Semiconductor Manufacturing, Appliances & Electronics, Adhesives & Sealants
- Product Families:Conductive Adhesives, Adhesives & Sealants
- Chemical Family:Epoxy & Epoxy Derivatives
MEB650-DA is a low viscosity silver filled flexible epoxy paste. This low ionic silver-filled paste is reworkable, solvent free, and electrically and thermally conductive. It is ideal for automatic dispensing in die- attach application with fine definition. Absolutely solvent-free and diluent free composition with low ionic impurities for high reliability. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). This stress free adhesive shows consistent medium bond strength up to 250°C at 200 psi.