- Applications:Printed Circuit Boards (PCBs), Parts & Components
- Product Families:Other Adhesives & Sealants, Adhesives & Sealants
- Chemical Family:Epoxy & Epoxy Derivatives
ME 7650-RC is a low viscosity version of ME7150 for snap curing applications. It is a reworkable, unfilled, electrically insulating, and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The stress-free flexible characteristic of this material makes it useful for bonding high-powered, large area dies and components.
ME 7650-RC can be cured rapidly at 150-180°C for approximately 60 seconds without creating voids. It can be readily reworked at 80-100°C.