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Adhesives & Sealants
Products in Adhesives & Sealants
3,928 Products found in Adhesives & Sealants
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EpoxySet Inc.
URACAST™ UC-2356
Ready to Use Product Type:
2K (2 component) Adhesive, Potting Compound, Encapsulant
Application Areas:
Relays, Coils, Printed Circuit Boards, Rectifiers, TV Sets, Amplifiers
Chemical Family:
Urethanes
UC-2356 is a two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows for easy flow and air release and excellent hydrolytic stability. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.
EpoxySet Inc.
EPOXIBOND™ EB-430-1HT
Chemical Family:
Epoxy & Epoxy Derivatives
Ready to Use Product Type:
Encapsulant
Application Areas:
Power Transformers, Semiconductors, Integrated Circuits, Electrical Components
EB-430-1HT is a highly versatile epoxy adhesive formulated for semiconductor industry. An easy to dispense liquid paste, it offers high heat transfer, low shrinkage and a coefficient of thermal expansion comparable to that of copper and aluminum. This adhesive is designed for protecting IC's in TAB, as well as glob-top encapsulant for COB placement. Other applications include fabricating heat sinks, bonding semiconductors and transistors to heat sinks and general-purpose bonding of electronic components.
EpoxySet Inc.
EpoxySet Inc. UB-50
Ready to Use Product Type:
Encapsulant, Potting Compound, 2K (2 component) Adhesive
Compatible Substrates & Surfaces:
Metal, Plastics, Ceramic
Chemical Family:
Urethanes
UB-50 is a clear, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release. The cured elastomer has excellent bond to metals, ceramics, and many plastics used in medical industry such as acrylic, polycarbonate, PVC etc. They also have excellent water resistance, and are exceptionally resistant to thermal shock. They can be used as an adhesive or for potting, casting and encapsulating applications.
EpoxySet Inc.
FLASHBOND™ UV-3610
Ready to Use Product Type:
Epoxy Adhesive
Cure Method:
Heat Cure
Chemical Family:
Epoxy & Epoxy Derivatives
FLASHBOND™ UV-6502CL is a low viscosity, high clarity, light curing epoxy adhesive that offers excellent strength wetting properties. UV-6502CL cures to a clear polymer and maintains clarity at elevated temperatures. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cures best in the UVA wavelengths (315-365nm).
EpoxySet Inc.
EPOXIBOND™ EB-316TC-2
Ready to Use Product Type:
Structural Adhesive
Application Areas:
Printed Circuit Boards, Semiconductors
Chemical Family:
Epoxy & Epoxy Derivatives
EB-316TC-2 is a two component, thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer, medical or optics.
EpoxySet Inc.
URACAST™ UC-2350
Ready to Use Product Type:
2K (2 component) Adhesive, Potting Compound, Encapsulant
Application Areas:
Relays, Coils, Printed Circuit Boards, Rectifiers, TV Sets, Amplifiers
Chemical Family:
Urethanes
UC-2350 is a two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows for easy flow and air release and excellent hydrolytic stability. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.
EpoxySet Inc.
URACAST™ UC-2521
Ready to Use Product Type:
2K (2 component) Adhesive, Potting Compound, Encapsulant
Application Areas:
Relays, Coils, Printed Circuit Boards, Rectifiers, TV Sets, Amplifiers
Chemical Family:
Urethanes
UC-2521 is a filled, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.
EpoxySet Inc.
URACAST™ UXP-052107-1
Ready to Use Product Type:
2K (2 component) Adhesive, Potting Compound, Encapsulant
Application Areas:
Relays, Coils, Printed Circuit Boards, Rectifiers, TV Sets, Amplifiers
Chemical Family:
Urethanes
UXP-052107-1 is a filled, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release.
EpoxySet Inc.
EPOXICAST™ EC-1850FT/EH-10E
Ready to Use Product Type:
Potting Compound, Encapsulant
Application Areas:
Oscillators, Power Transformers, Amplifiers
Chemical Family:
Epoxy & Epoxy Derivatives
EC-1850FT with EH-10E Hardener is a very low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.
EpoxySet Inc.
EPOXICAST™ 1006M-4
Ready to Use Product Type:
Encapsulant, Potting Compound
Application Areas:
Capacitor Bushings, Power Transformers, Integrated Circuits
Chemical Family:
Epoxy & Epoxy Derivatives
EC-1006M-4 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.
EpoxySet Inc.
EpoxySet Inc. EC-1012M/EH-20M
Ready to Use Product Type:
Encapsulant, Potting Compound
Application Areas:
Capacitor Bushings, Power Transformers, Integrated Circuits
Chemical Family:
Epoxy & Epoxy Derivatives
EC-1012M/EH-20M is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.
EpoxySet Inc.
EPOXIBOND™ 142HT-1
Ready to Use Product Type:
Adhesive
Application Areas:
Fiber Optic Cables, Capacitors, Capacitor Bushings, Semiconductors, Medical Devices, Electronic Components
Compatible Substrates & Surfaces:
Metal, Ceramic, Glass
Chemical Family:
Epoxy & Epoxy Derivatives
EB-142HT-1 is unfilled, low viscosity, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates.
EpoxySet Inc.
EpoxySet Inc. EC-1012MFR-HT
Ready to Use Product Type:
Encapsulant, Potting Compound
Application Areas:
Capacitor Bushings, Power Transformers, Integrated Circuits
Chemical Family:
Epoxy & Epoxy Derivatives
EC-1012MFR-HT is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.
EpoxySet Inc.
EPOXICAST™ EC-1015
Ready to Use Product Type:
Potting Compound, Encapsulant
Application Areas:
Power Transformers, Oscillators, Semiconductors, Amplifiers, Integrated Circuits
Chemical Family:
Epoxy & Epoxy Derivatives
EC-1015 is a low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.
EpoxySet Inc.
EPOXICAST™ EC-1006
Ready to Use Product Type:
Encapsulant, Potting Compound
Application Areas:
Capacitor Bushings, Power Transformers, Integrated Circuits
Chemical Family:
Epoxy & Epoxy Derivatives
EPOXICAST-1006/EH-24 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. The cured system provides excellent resistance to moisture, most organic solvents and inorganic chemicals.
EpoxySet Inc.
EpoxySet Inc. EB-126HT
Ready to Use Product Type:
2K (2 component) Adhesive
Application Areas:
Electrical Components
Chemical Family:
Novolac Epoxy, Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol F Type Epoxy
EB-126HT is two components, clear epoxy system. This long work life, low viscosity resin system is designed for the bonding, coating, sealing, and impregnation of electrical and structural components. The cured system has excellent electrical and physical properties above 250°C with outstanding high temperature stability. It also provides excellent moisture, chemical, and corrosion resistance as well as resistance to thermal and mechanical shock.
EpoxySet Inc.
EPOXICAST™ EC-1009
Ready to Use Product Type:
Encapsulant, Potting Compound
Application Areas:
Capacitor Bushings, Power Transformers, Integrated Circuits
Chemical Family:
Epoxy & Epoxy Derivatives
EC-1009 is a pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.
Chicago Glue & Machine
Chicago Glue & Machine 5221 100
Ready to Use Product Type:
Hot-Melt Adhesive
Compatible Substrates & Surfaces:
Stainless Steel, Coated Surfaces, Styrene Butadiene Styrene (SBS), Metal
Chemical Family:
Ethylene Vinyl Acetate (EVA)
Chicago Glue & Machine 5221 100 is fast setting, good hot tack glue stick designed for end of line packaging. Typically used to bond uncoated, clay coated, SBS, SUS, an similar uncoated and lightly coated materials.
Chicago Glue & Machine
Chicago Glue & Machine HME3122LTPEL
Ready to Use Product Type:
Hot-Melt Adhesive
Chicago Glue & Machine HME3122LTPEL is a formulated low temperature applied hot melt primarily used in packaging applications. HME3122LTPEL has aggressive hot tack, excellent adhesion, and excellent machining properties. HME3122LTPEL exhibits fast set speeds.
Creative Materials Inc.
Creative Materials 805-19C
Ready to Use Product Type:
Conductive Adhesive, 1K (1 component) Adhesive, Epoxy Adhesive
Cure Method:
Air Dry
Application Method:
Injection
Chemical Family:
Epoxy & Epoxy Derivatives
The 805-19C is a one-component, high performance, silver filled room temperature curable epoxy adhesive.Features One component room temperature curing
Creative Materials Inc.
Creative Materials 121-23
Ready to Use Product Type:
Epoxy Adhesive, Conductive Adhesive
Application Areas:
Ribbon Cables, Electrical Components
Compatible Substrates & Surfaces:
Metal
Application Method:
Dip Coating, Injection, Screen Coating
Chemical Family:
Epoxy & Epoxy Derivatives
121-23 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 121-23 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product is useful in application where shorts between closely spaced contacts are a concern. This system features excellent thermal stability.Features B-stageable conductive epoxy adhesive, ideal for In Mold Electronics connections with adhesion to polycarbonate
Creative Materials Inc.
Creative Materials 127-03
Ready to Use Product Type:
Epoxy Adhesive, Conductive Adhesive, 1K (1 component) Adhesive
Cure Method:
Heat Cure
Compatible Substrates & Surfaces:
Ceramic, Aluminum, Composites, Copper, Metal
Application Method:
Injection, Screen Coating
Chemical Family:
Epoxy & Epoxy Derivatives
127-03 is a screen-printable, B-Stageable, thermally conductive, one part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 127-03 is designed to exhibit minimal flow during bonding. This product has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates. Additional applications include, but are not limited to, die attachment, printed circuit board fabrication, advanced material composites, LED attachment, and heat sink bonding. The chemistry in 127-03 features excellent thermal stability and flexibility in the B-Staged form and is optimal for absorbing stress when bonding mismatched CTE substrates. 127-03 is a thermally conductive, electrically insulating version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance Highly thermally conductive epoxy adhesive B-Stageable
Creative Materials Inc.
Creative Materials 126-08
Ready to Use Product Type:
Conductive Adhesive, 1K (1 component) Adhesive, Epoxy Adhesive
Application Method:
Injection, Screen Coating
Chemical Family:
Epoxy & Epoxy Derivatives
126-08 is a screen-printable, B-Stageable, highly thermally conductive, one part epoxy coating and adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing and high performance coatings.Features Extremely high thermally conductive epoxy adhesive
Creative Materials Inc.
Creative Materials 108-50MG
Ready to Use Product Type:
Conductive Adhesive, 1K (1 component) Adhesive, Potting Compound, Epoxy Adhesive
Application Method:
Injection
Chemical Family:
Epoxy & Epoxy Derivatives
108-50MG is a one component, thermally conductive, low stress, low shrink potting compound and adhesive. 108-50MG features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring Class "F" service temperature rating. 108-50MG can also be used as an adhesive for bonding stress sensitive substrates when low ionics or low hydrolyzable chloride is required. 108- 50MG is a microelectronics grade version of 108-50.Features Microelectronics grade Low stress Moderate thermally conductive adhesive/potting compound
Creative Materials Inc.
Creative Materials 811-64A/B
Ready to Use Product Type:
2K (2 component) Sealant, Potting Compound
Application Areas:
Electrical Components
Cure Method:
Air Dry
The 811-64 System is a two component, high performance, room temperature curing, highly filled potting / encapsulating compound. 811-64 is the carbon filled version of 812-48.FeaturesTwo component, high performance, exhibits exceptional wetting and void free during pouring, with low shrinkage.
Creative Materials Inc.
Creative Materials 127-31
Ready to Use Product Type:
Potting Compound, Epoxy Adhesive, Conductive Adhesive, Solvent free (100% Solids) Adhesive, 1K (1 component) Adhesive
Application Method:
Injection
Chemical Family:
Epoxy & Epoxy Derivatives
127-31 is an extremely flexible one-component, syringe dispensable, 100% solids, thermally conductive, electrically insulating soft epoxy adhesive, encapsulant, and potting compound. This system features excellent thermal stability, chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 127-31 features a low durometer and is highly flexible allowing it to absorb stress when bonding mismatched CTE substrates. 127-31 even displays some elastomeric properties. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding.Features Elastomeric Flexible thermally conductive adhesive/potting compound
Creative Materials Inc.
Creative Materials 125-35C
Ready to Use Product Type:
Epoxy Adhesive, Conductive Adhesive, Solvent free (100% Solids) Adhesive, 1K (1 component) Adhesive
Application Method:
Injection
Chemical Family:
Epoxy & Epoxy Derivatives
125-35C is a syringe dispensable, 100 % solids, thermally conductive, electrically insulating, precatalyzed, epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 125-35C is flexible and is able to absorb stress when bonding mismatched CTE substrates. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. This is an electrically insulating, thermally conductive version of 124-08C.Features Highly thermally conductive epoxy adhesive
Creative Materials Inc.
Creative Materials 122-44(SP)C
Chemical Family:
Silicones
Ready to Use Product Type:
Pressure Sensitive Adhesive, Conductive Adhesive
Application Method:
Screen Coating
Compatible Substrates & Surfaces:
Metal, Steel, Stainless Steel, Aluminum
122-44(SP)C is a flexible anisotropic conductive silicone adhesive. features the highest degree of thermal and mechanical reliability over any other conductive adhesive technology and provides no failures during thermal cycling, heat aging, shocking or vibration due to the reliability from the elasticity of the product. This product is very resistant to flexing and creasing. 122-44(SP)C is designed for bonding rubber to a variety of substrates such as aluminum, stainless steel, and steel. Additionally, 122-44(SP)C is one of the few conductive adhesives that can bond to silicone substrates and surfaces.122-44(SP)C is a non-flammable version of 122-44.Features Non-flammable silicone, pressure sensitive adhesive
Creative Materials Inc.
Creative Materials 102-32NFC
Ready to Use Product Type:
Conductive Adhesive
Application Areas:
Electrical Components
Application Method:
Injection
Chemical Family:
Silicones
102-32NFC is a flexible electrically conductive silicone adhesive. 102-32NFC features the highest degree of thermal and mechanical reliability over any other conductive adhesive technology and provides no failures during thermal cycling, heat aging, shocking or vibration due to the reliability from the elasticity of the product. Some applications for 102-32NFC include, but are not limited to, elastomeric conductive bridging and bonding, conductive bonding of low surface energy materials, conductive via filling and electrical attachments for stress sensitive devices. 102-32NFC is one of the few conductive adhesives that can bond to silicone substrates and surfaces. 102-32NFC is a non-flammable version of 102-32.Features High temperature Flexible silicone adhesive Non-flammable.
Creative Materials Inc.
Creative Materials 128-32-50
Ready to Use Product Type:
Epoxy Adhesive, Conductive Adhesive
Application Areas:
Ribbon Cables, Electrical Components
Compatible Substrates & Surfaces:
Metal
Application Method:
Dip Coating, Injection, Screen Coating
Chemical Family:
Epoxy & Epoxy Derivatives
128-32-50 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32-50 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32-50 is optimized for a 0.002†bond line.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance B-stageable epoxy adhesive, ideal for 50µm bond line
Creative Materials Inc.
Creative Materials 128-19
Ready to Use Product Type:
Epoxy Adhesive, Structural Adhesive, 1K (1 component) Adhesive
Application Areas:
Electrical Components
Compatible Substrates & Surfaces:
Copper, Aluminum, Metal, Ceramic
Application Method:
Injection, Screen Coating
Chemical Family:
Epoxy & Epoxy Derivatives
128-19 is a screen-printable, B-stageable, one-part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 128-19 is designed to exhibit minimal flow during bonding. This product provides bonds of dissimilar materials and has has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates. Additional applications include, but are not limited to, assembling electronic components. This system features excellent thermal stability and flexibility in the B-Staged form. 128-19 is an electrically insulating version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance laminating adhesive
Creative Materials Inc.
Creative Materials 102-12A/B
Ready to Use Product Type:
Epoxy Sealant, Potting Compound, 2K (2 component) Sealant
Cure Method:
Air Dry
Chemical Family:
Epoxy & Epoxy Derivatives
102-12 is a black, two component thermally conductive epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 102-12 is an improved, crack-resistant version of F947. Use with standard Part B for room temperature cure.FeaturesThermal cycle resistantBlack, epoxy compound.Room temperature cureImproved crack resistanceHigh thermal conductivity
Creative Materials Inc.
Creative Materials 126-22
Ready to Use Product Type:
Conductive Adhesive
Application Areas:
Ribbon Cables, Electrical Components
Compatible Substrates & Surfaces:
Plastics, Polyimide, Glass
Application Method:
Screen Coating
Chemical Family:
Thermoplastic Polyurethanes (TPU), Polyurethanes (PU)
126-22 is a pre-catalyzed, solvent-resistant, anisotropic conductive adhesive. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to methyl ethyl ketone. This product features a hydrophobic resin that has proven well in humid aging studies and is also very resistant to scratching and creasing. Applications for 126-22 include, but are not limited to, conductive splicing of ribbon cables, PTF circuits attachments, and LED surface bonding demands. This product is useful in application where ensuring good electrical contact for all connections is a concern.Features Solvent resistant epoxy adhesive Ideal for LED bonding
Creative Materials Inc.
Creative Materials 128-32FP
Ready to Use Product Type:
Epoxy Adhesive, Conductive Adhesive
Application Areas:
Ribbon Cables, Electrical Components
Compatible Substrates & Surfaces:
Metal
Application Method:
Dip Coating, Injection, Screen Coating
Chemical Family:
Epoxy & Epoxy Derivatives
128-32FP is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32FP include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. 128-32FP is especially useful in applications where shorts between closely spaced contacts is a concern and it features a finer pitch than traditional anisotropic conductive materials. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32FP is able to be used with pad sizes as small as 70 μm and spaces as fine as 30 μm.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance Excellent Room Temperature Stability
Creative Materials Inc.
Creative Materials 128-17A/B
Ready to Use Product Type:
Conductive Adhesive, 2K (2 component) Adhesive
Application Areas:
Electrical Components
Cure Method:
Air Dry
Application Method:
Injection
128-17A/B is a two-part, room temperature curing, silver-filled fast curing adhesive. This system is designed for making electrical and mechanical attachments on electrical components and devices and features a very quick setup time allowing for rapid processing and repair in a variety of applications. 128-17A/B features a volumetric 3-to-2 mix ratio, allowing it to be easily handled by most mixing equipment.Features Fast curing, room temperature curing conductive adhesive
Creative Materials Inc.
Creative Materials 127-45
Ready to Use Product Type:
Epoxy Adhesive, Conductive Adhesive, 1K (1 component) Adhesive
Compatible Substrates & Surfaces:
Painted Surfaces
Application Method:
Injection
Chemical Family:
Epoxy & Epoxy Derivatives
127-45 is a die attach adhesive engineered for high reliability performance and high efficiency production. This product is a syringe dispensable, anisotropic conductive, one component, 100% solids epoxy adhesive and features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesion to gold plated substrates and tin/lead solder terminated components, die attach operations, printed circuit board fabrication, advanced material composites, sealing and high performance coatings. 127-45 is an anisotropic conductive version of Electraset™ 620.Features Die attach adhesive
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