Products

DAP D72/6120F is a versatile diiallyl ortho-phthalate molding compound, filled with short glass fibers and featuring flame retardant properties. Supplied in a free-flowing granular form, this compound is well-suited for a variety of molding applications. It can be easily molded using compression, transfer, or injection equipment and can be preformed with ease. An important distinction is that it has passed NASA outgassing tests, indicating its suitability for applications with stringent outgassing requirements, particularly in industries like aerospace where such standards are critical.

Cosmic Epoxy E4920 is a mineral-filled epoxy molding compound available either in granular form or preformed in various sizes and weights. It features excellent moisture resistance, thermal cycling stability, and remarkable moldability. Furthermore, parts molded from this material do not support fungus growth, and it is specifically designed for the encapsulation of passive devices, including capacitors, inductors, diodes, and rectifiers.

Cosmic Alkyd 3D36 is a specialized alkyd molding compound that incorporates long glass fibers for enhanced impact resistance and flame retardant properties. Supplied in flake form, it is designed for ease of use and versatility in molding applications. This compound molds readily using standard compression or transfer equipment, and it maintains its performance for up to one year when stored at temperatures of 100°C or below. Its unique blend of properties makes it suitable for applications that require both impact resistance and flame retardancy.

Cosmic Epoxy E484-FDA is a mineral-filled, glass-reinforced, electrical-grade epoxy molding compound supplied in granular form. It has received approval for direct food contact. Notably, it possesses outstanding mechanical strength and electrical properties, especially at high temperatures, and has met the rigorous NASA outgassing standards. This material is used in electrical hardware applications such as underwater connectors and other insulation needs.

DAP K77/6220F is a high-quality diallyl iso-phthalate molding compound that combines short glass fibers and flame retardant properties. Supplied in granular form, it is designed for ease of use in molding applications. This compound has excellent flow characteristics, making it easy to pour and mold in standard compression, transfer, or injection equipment. Its flame retardant properties make it suitable for applications where fire resistance is a critical factor, such as in the production of components for fire safety equipment or other high-temperature environments.

DAP K31/6220 is a versatile diallyl iso-phthalate molding compound, filled with short glass fibers and supplied in granular form. This compound offers excellent heat resistance and is suitable for a wide range of applications. It is easy to work with, pouring easily and allowing for preforming. Additionally, it molds readily using standard compression, transfer, or injection equipment. One notable feature of K31/6220 is its FDA approval for direct food contact use, making it a reliable choice for applications in the food industry where heat resistance and safety standards are essential.

DAP K61/6230 is a general-purpose diallyl iso-phthalate molding compound that contains long-glass fiber fillers. It is supplied in flake form, making it suitable for various molding applications. This compound can be preformed and easily molded using standard compression and transfer equipment. It offers good moldability and is designed to meet the requirements of general-purpose molding applications where a balance of mechanical strength and ease of processing is essential.

DAP D33/6120 is a versatile general purpose diallyl ortho-phthalate molding compound that incorporates short glass fibers for added strength. Supplied in a free-flowing granular form, it is designed for ease of use in molding applications. This compound can be easily molded using compression, transfer, or injection equipment, and it can also be readily preformed to suit the specific requirements of the application. Its blend of properties makes it suitable for a range of molding applications where strength and versatility are essential.

Cosmic Epoxy E4920VS is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and is offered in various colors. This product features a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.

Cosmic Epoxy EH81 is an iron-filled epoxy molding compound available in a black granular form. It is specifically designed for EMI/RFI shielding applications and can be used in both compression and transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to simplify the manufacturing process by eliminating the labor-intensive over/under molding steps.

Farboset® 1180 is a granular, glass-filled, general-purpose anhydride epoxy molding compound. It is formulated for encapsulation applications where excellent thermal shock resistance and physical strength are required. This compound helps protect electronic and electrical components by providing thermal shock resistance and maintaining their integrity under challenging conditions.

Cosmic Epoxy E4920D is a mineral-filled epoxy molding compound that is available in either granular form or as preformed shapes in various sizes and weights. This compound is commonly used for molding applications and offers good versatility in manufacturing processes.

DAP D69/6130 is a versatile diallyl ortho-phthalate molding compound with the advantage of being long-glass fiber filled. Supplied in flake form, this compound is convenient to work with. It can be easily molded using compression or transfer equipment and can be preformed for improved handling. Notably, it maintains its performance even when stored at room temperature for up to one year. This makes it a reliable choice for a wide range of applications where long-term performance and ease of use are essential.

Farboset® 2500 is a mineral-filled, flame-retardant, novolac epoxy molding compound that offers fast cure rates at low temperatures, laser markability, and good moldability. This compound is formulated for encapsulating surface mount ceramic and tantalum capacitors, along with other applications that require quick cycle times. Its flame-retardant properties make it suitable for applications where fire safety is a concern, while its rapid curing and ability to be laser marked enhance its utility in modern production processes.

Cosmic Epoxy E4920AC is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and is offered in various colors. This product features a mild odor and is insoluble in water, making it suitable for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.

Cosmic Alkyd 3D94 is a mineral-filled polyester molding compound that is available in sheet form. This compound is designed for ease of use in molding applications and can be readily molded using standard compression or transfer equipment. It offers good moldability, making it suitable for a range of applications where a combination of mechanical strength and cost-effectiveness is desired. When stored at temperatures of 50°C or below, it has a shelf life of six months, providing flexibility in manufacturing and storage.

Farboset® 9025 is a nonanhydride epoxy powder coating that is specifically formulated for use as an encapsulant for electronic components. One of its key characteristics is its excellent resistance to cracking during thermal cycling, which makes it ideal for applications where electronic components are subjected to temperature variations. This epoxy powder coating is designed for coating various electronic components, including resistor networks, hybrid circuits, varistors, and ceramic capacitors.

Farboset® 9544 is designed for coating a variety of electronic components, including resistor networks, hybrid circuits, varistors, and ceramic capacitors. Its resistance to cracking during thermal cycling is a valuable feature for maintaining the integrity of these components when subjected to temperature variations. Additionally, it can be applied using wheel and fluid bed equipment, providing flexibility in the coating process.

Cosmic Epoxy EH71 is an iron-filled epoxy molding compound available in a black granular form. It is well-suited for EMI/RFI shielding applications and can be used in either compression or transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to streamline the manufacturing process by eliminating the labor-intensive over/under molding steps.

Farboset® 2472V0 is a novolac epoxy molding compound that is mineral-filled for enhanced performance. It offers rapid cure rates, excellent moldability, and exceptional resistance to thermal shock and moisture. This compound has been specially formulated to provide improved resistance to moisture ingress, making it an ideal choice for applications where exposure to moisture is a concern. Additionally, it features a high glass transition temperature, ensuring optimum reliability in performance. Its combination of properties makes it well-suited for a range of applications where resilience to environmental conditions is crucial.

Farboset® 1707-2 is a mineral and glass-filled, anhydride epoxy molding compound that is engineered for the encapsulation of various electrical and electronic components. It is specifically formulated to provide high thermal shock resistance, making it ideal for protecting components that may be subjected to rapid temperature changes or other harsh environmental conditions. This compound helps ensure the reliability and durability of encapsulated components.

Farboset® 2510 is a mineral-filled, novolac epoxy molding compound known for its fast cure rates at low temperatures, excellent laser markability, and good moldability. This compound is specially formulated for encapsulating surface mount ceramic and tantalum capacitors, as well as other applications that demand quick cycle times. Its unique properties and rapid curing make it well-suited for applications where fast production and efficient marking are essential.

Farboset® 1115 is a granular, mineral-filled, anhydride epoxy molding compound with fast cure rates and excellent hot strength. It is specially designed for encapsulating various electrical and electronic components, including coils, transformers, bushings, switches, and more. The material offers good hot rigidity during the molding process and is commonly used in injection and transfer molding applications.

Cosmic Epoxy E4920FC is a mineral-filled epoxy molding compound available either in granular form or preformed in a variety of sizes and weights. It offers excellent moisture resistance, thermal cycling stability, and outstanding moldability. Parts molded from this material also resist fungus growth and are designed for the encapsulation of passive devices such as capacitors, inductors, diodes, and rectifiers.

Farboset® 2720 is a mineral-filled epoxy molding compound known for its rapid curing, exceptional moldability, and remarkable resistance to thermal shock and moisture. This compound is tailored to offer enhanced protection against moisture ingress and boasts a high glass transition temperature, making it an ideal choice for ensuring reliability in performance. Its primary purpose is to encapsulate a wide variety of electronic devices, including tantalum and ceramic capacitors, resistors, and resistor networks, providing them with a robust shield against environmental factors and mechanical stress.

Farboset® 9020 is a nonanhydride epoxy powder coating known for its excellent moisture resistance. It is specifically designed for encapsulating components such as ceramic and film capacitors, coils, thermistors, and resistors. This coating helps protect these components from moisture and environmental factors, ensuring their performance and reliability. Farboset® 9020 can be applied using various methods, including fluidized bed, wheel coaters, and electrostatic spray techniques.

Cosmic Epoxy EH40 is an iron-filled epoxy molding compound available in a black granular form. It is suitable for EMI/RFI shielding applications and can be used for compression or transfer molding to create core rods or encapsulate surface mount and axial leaded inductors. This material simplifies the manufacturing process by allowing for single molded applications, eliminating the need for labor-intensive over/under molding.

Farboset® 1160 is a granular, mineral-filled, anhydride epoxy molding compound designed for the encapsulation of various electrical and electronic components. It offers fast cure rates, long flow, and excellent thermal shock resistance. This compound is suitable for applications involving the encapsulation of coils, transformers, capacitors, diodes, relays, and other components that require good hot rigidity during the molding process.

Cosmic Epoxy E4930R is a mineral-filled epoxy molding compound supplied in granular form. It is designed for encapsulating various electronic components, including optocouplers, capacitors, resistors, resistor networks, transistors, SOICs (Small Outline Integrated Circuits), and QFPs (Quad Flat Packages). This material helps protect and insulate these components, ensuring their proper functioning in electronic applications.

Cosmic Epoxy E484 is a mineral-filled, glass-reinforced, electrical-grade epoxy molding compound supplied in granular form. It boasts excellent mechanical strength and electrical properties, particularly at high temperatures, and has successfully passed NASA outgassing tests. This compound finds applications in electrical hardware, including underwater connectors and various insulation needs.

Cosmic Epoxy E4920CD is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, offered as granules, preforms, or powders, and is available in various colors. This product has a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.

DAP D45 is a mineral-filled, flame retardant, general-purpose diallyl ortho-phthalate molding compound supplied in a free-flowing granular form. It offers a cost-effective solution while maintaining essential properties such as high dimensional stability, arc resistance, and excellent dielectric strength. This compound is well-suited for structural parts, housings, terminals, insulators, and other applications where both strength and economy are important factors.

Cosmic Epoxy E4940S is a mineral-filled epoxy molding compound supplied in granular form. It offers excellent dimensional stability, improved thermal cycling properties, and exceptional moisture resistance. This product is specifically designed for high-volume encapsulation of resistor networks and fiber-optic connectors that demand high quality, reliability, and excellent moldability.

Farboset® 2460 is a novolac epoxy molding compound filled with minerals. It is designed for encapsulating a variety of electrical and electronic components, including tantalum and ceramic capacitors, resistors, resistor networks, and high-performance coils. This compound is formulated to provide fast cure rates, excellent moldability, and superior resistance to thermal shock and moisture. It has been specifically designed to offer improved resistance to moisture ingress, making it a reliable choice for applications where moisture resistance is crucial.

DAP 306 is a general-purpose diallyl ortho-phthalate molding compound filled with Orlon and supplied in flake form. It is suitable for a variety of applications, including switches, terminals, insulators, cups, cases, and other components that require strength as well as chemical and moisture resistance. It can also be used for the encapsulation of electrical and electronic components.

Cosmic Epoxy E4940P is a mineral-filled, glass-reinforced epoxy molding compound supplied in granular form. It is specifically designed for high-volume encapsulation applications, particularly for resistor networks and fiber-optic connectors. This compound offers high quality, reliability, and good moldability for such applications.