Products

128-32-50 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32-50 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32-50 is optimized for a 0.002” bond line.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance B-stageable epoxy adhesive, ideal for 50µm bond line

128-19 is a screen-printable, B-stageable, one-part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 128-19 is designed to exhibit minimal flow during bonding. This product provides bonds of dissimilar materials and has has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates. Additional applications include, but are not limited to, assembling electronic components. This system features excellent thermal stability and flexibility in the B-Staged form. 128-19 is an electrically insulating version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance laminating adhesive

124-24 is a screen-printable, anisotropic, UV cured adhesive. This product can be used on a variety of substrates such as polycarbonate, treated and untreated polyesters, Kapton, epoxy/glass PC boards and glass.Features UV curable flexible adhesive

126-22 is a pre-catalyzed, solvent-resistant, anisotropic conductive adhesive. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to methyl ethyl ketone. This product features a hydrophobic resin that has proven well in humid aging studies and is also very resistant to scratching and creasing. Applications for 126-22 include, but are not limited to, conductive splicing of ribbon cables, PTF circuits attachments, and LED surface bonding demands. This product is useful in application where ensuring good electrical contact for all connections is a concern.Features Solvent resistant epoxy adhesive Ideal for LED bonding

128-32FP is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32FP include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. 128-32FP is especially useful in applications where shorts between closely spaced contacts is a concern and it features a finer pitch than traditional anisotropic conductive materials. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32FP is able to be used with pad sizes as small as 70 μm and spaces as fine as 30 μm.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance Excellent Room Temperature Stability

122-01(P) is a single component, electrically insulating, solvent strippable, polyimide based, ink and coating suitable for application by screen-printing, dipping and syringe dispensing. This product is designed for use on electrical and electronic components where high temperature stability is required. The low CTE and high flexibility allow for good adhesion and low stress when exposed to high temperatures. 122-01(P) is a flexible version of CMI 122-01.Features Polyimide dielectric High flexibility

122-44(SP)C is a flexible anisotropic conductive silicone adhesive. features the highest degree of thermal and mechanical reliability over any other conductive adhesive technology and provides no failures during thermal cycling, heat aging, shocking or vibration due to the reliability from the elasticity of the product. This product is very resistant to flexing and creasing. 122-44(SP)C is designed for bonding rubber to a variety of substrates such as aluminum, stainless steel, and steel. Additionally, 122-44(SP)C is one of the few conductive adhesives that can bond to silicone substrates and surfaces.122-44(SP)C is a non-flammable version of 122-44.Features Non-flammable silicone, pressure sensitive adhesive

126-08 is a screen-printable, B-Stageable, highly thermally conductive, one part epoxy coating and adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing and high performance coatings.Features Extremely high thermally conductive epoxy adhesive

127-03 is a screen-printable, B-Stageable, thermally conductive, one part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 127-03 is designed to exhibit minimal flow during bonding. This product has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates. Additional applications include, but are not limited to, die attachment, printed circuit board fabrication, advanced material composites, LED attachment, and heat sink bonding. The chemistry in 127-03 features excellent thermal stability and flexibility in the B-Staged form and is optimal for absorbing stress when bonding mismatched CTE substrates. 127-03 is a thermally conductive, electrically insulating version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance Highly thermally conductive epoxy adhesive B-Stageable

121-23 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 121-23 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product is useful in application where shorts between closely spaced contacts are a concern. This system features excellent thermal stability.Features B-stageable conductive epoxy adhesive, ideal for In Mold Electronics connections with adhesion to polycarbonate

128-38 is a screen-printable, B-Stageable, one-part epoxy coating and laminating adhesive that maintains hermetic properties up to 170°C. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include lid attach adhesives, printed circuit board fabrication, advanced material composites, sealing, and high-performance coatings.Features Hermetic properties B-Stageable Long Screen Life High Tg Hermetic lid attach

124-22C is a pre catalyzed, solvent-resistant, anisotropic conductive ink, coating and adhesive. This product features excellent adhesion to Kapton, Mylar, glass, polycarbonate and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to methyl ethyl ketone. It is also very resistant to scratching and creasing. Applications for 124-22C include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of surface mounted devices. This product is useful in application where shorts between closely spaced contacts is a concern.Features Solvent resistant, low temperature curing epoxy adhesive

126-37 is a screen-printable, B-Stageable, anisotropic conductive, one part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 126-37 is designed to exhibit minimal flow during bonding. This product provides superior electrical conductivity when bonding circuit materials to metal back planes and heat sinks. This product has excellent adhesion to aluminum, ceramic, and a variety of other substrates. Additional applications include, but are not limited to, assembling electrical and electronic components. This system features excellent thermal stability and flexibility in the B-Staged form. 126-37 is an anisotropic conductive version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance

127-04 is a screen-printable, B-Stageable, one part epoxy coating and laminating adhesive. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings.Features B-Stageable laminating adhesive

128-32-25 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32-25 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32-25 is optimized for a 0.001” bond line.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance Excellent Room Temperature Stability

127-48D is a matte finish, flexible, electrically insulating ink and coating suitable for application by screen printing, dipping, and syringe dispensing. This product features excellent adhesion to Kapton, Mylar, polycarbonate, glass, and a variety of other surfaces. Unlike conventional insulating materials, this product is very resistant to flexing and creasing. Some applications for 127-48D include, but are not limited to, insulating polyimide flexible circuits, polymer thick film circuitry, and membrane switches. 127-48D is a thermosetting version of 124- 18T.Features Solvent resistant washable dielectric ink ideal for fabrics

127-49A/B is an electrically conductive, two-component, silicone ink and coating suitable for high temperature applications. 127-49A/B is suitable for application via syringe dispensing and screen printing. Unlike typical conductive inks, the high temperature capability of this product makes it useful in a range of unique applications such as extreme performance coatings. 127-49A/B is also able to cure at room temperature.Features Two part, room temperature curing silicone conductive adhesive.

122-38(SD) is a single component, silver filled, syringe dispensable, 100% solid, electrically conductive, epoxy adhesive. 122-38(SD) provides for fine pitch resolution, when syringe dispensed, stencil printed, or screen-printed. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, die attachment, printed circuit board fabrication, advanced material composites, sealing and high performance coatings. 122-38(SD) provides excellent adhesion to gold plated substrates, as well as tin/lead solder terminated components.Features Ionically clean die attach adhesive

124-07 is a screen-printable, B-Stageable, one part epoxy coating and laminating adhesive. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings.Features Screen-print

122-01UT is a single component ink and adhesive suitable for application by screen printing or syringe dispensing. This product features a unique high continuous operation temperature and very high glass transition temperature making it especially well-suited for extreme conditions found in furnace, heater, and aerospace applications. 122-01UT is a version of 122-01(P) with improved adhesion to a wide range of substrates and features improved flexibility over typical high temperature materials.Features High service temperature polyimide dielectric.

124-33(S) is a solvent resistant flexible electrically conductive adhesive. This product features excellent adhesion to Kapton®, Mylar®, glass and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 124-33(S) include, but are not limited to, electrical attachments for surface mounted devices and heat-sealing openings in emi/rfi enclosures. 124-33(S) is a thermosetting version of 124-33 that is chemical and age resistant.Features Extremely flexible conductive adhesive

112-05 is screen-printable, anisotropic, conductive hot melt adhesive. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. The product can be rebonded many times by simply adding heat and slight pressure. Applications for 112-05 include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of surface mounted devices. This product is useful in application where shorts between closely spaced contacts is a concern. 112-05 is a screen-printable version of 111-29.Features Thermoplastic urethane adhesive

122-44 is a silicone, pressure sensitive, screen-printable anisotropic conductive adhesive. The overall balance of peel strength, cohesion, lap shear strength, high temperature holding power, and conductivity provides a versatility that makes this product useful in a wide range of fastening and bonding applications. This product is very resistant to flexing and creasing. 122-44 is designed for bonding rubber to a variety of substrates such as aluminum, stainless steel, and steel. Peel strength develops rapidly and continues to increase for approximately one week.Features Silicone, pressure sensitive adhesive

126-26 is a screen-printable, non-tacky, silicone dielectric coating and adhesive. The overall balance of peel strength, cohesion, lap shear strength and high temperature holding power provides a versatility that makes this product useful in a wide range of fastening and bonding applications. This product is very resistant to flexing and creasing. 126-26 is designed for bonding rubber to a variety of substrates such as aluminum, stainless steel, and steel. Peel strength develops rapidly and continues to increase for approximately 1 week. 126- 26 is designed to be non-tacky on cure.Features Non-Flammable Silicone dielectric ink and coating.

120-24 is a carbon filled, screen-printable, electrically conductive, epoxy-based ink and coating suitable for application by screen- printing, dipping and syringe dispensing. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 120-24 include, but are not limited to, printed potentiometers, printed resistors, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, membrane switches and anode coatings for tantalum capacitors. 118-41 is a 0.01 Ω/sq/mil silver version of this product.Features High temp epoxy ink, adheres to ITO and polyimide substrates

126-49(SP) is a highly elastomeric, electrically conductive, silicone-based medical electrode ink. This product features a high-performance in a wide range of sensing, delivery, and stabilizing applications and features excellent repeatability, stability, and accuracy. This product is highly resistant to flexing and creasing and is ideal for applications that include, but are not limited to: ECG electrodes, TENS electrodes, reference electrodes, and transdermal drug delivery. 126-49(SP) is one of the few conductive materials that can bond/adhere to silicone substrates and surfaces and features a uniquely long pot life.Features Excellent Bonding to Difficult Surfaces High Temperature Resistance Long screen life Superior Elasticity Screen Printable/Syringe Dispensable Elastomeric electrode ink for reference electrodes

113-15 is a radio opaque ink/coating for application by screen printing, dipping and syringe dispensing. The product features excellent adhesion to Kapton, Mylar, glass and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to abrasion, scratching, flexing and creasing. Some applications for 113–15 include, but are not limited to, manufacturing of medical devices and instruments.Features Low temperature curing, flexible & highly filled, ideal for polyester

120-07(LPS) is a screen-printable, electrically conductive ink, coating and adhesive suitable for application by stamping, screen-printing, dipping and syringe dispensing. This product features excellent adhesion to Kynar, Kapton, Mylar, polycarbonate, glass and can also be used on low surface energy coatings such as transparent conductive oxides. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 120-07(LPS) include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, membrane switches, electrical attachments for surface mounted devices, and anode coatings for tantalum capacitors. 120-07(LPS) is a cross-linking version of 120-07(LP) and a more flexible version of 120-07T.Features Electrically conductive for ITO and polycarbonate

119-31 is an extremely flexible, pad printable radio opaque ink/coating for application by pad printing, dipping and syringe dispensing. The product features excellent adhesion to Kapton, Mylar, glass and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to abrasion, scratching, flexing and creasing. Some applications for 119-31 include, but are not limited to, manufacturing of medical devices and instruments.Features Very flexible, low temperature curing, ideal for urethane

113-09H is a silver/silver chloride, medical grade, electrically conductive ink and coating suitable for application by screen printing, dipping and syringe dispensing. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 113-09H include, but are not limited to, transdermal drug delivery, ECG electrodes, tens electrodes and muscle stimulator electrodes. 113-09H is a more hydrophilic version of 113-09.Features Hydrophilic version of 113-09

114-34A/B119-44 is a two component, solvent-resistant, electrically conductive ink, coating and adhesive suitable for screen-printing circuit lines. This product features excellent adhesion to Kapton, Mylar, glass, polycarbonate and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to methyl ethyl ketone. It is also very resistant to scratching and creasing. Some applications for 114-34/B119-44 include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, membrane switches, electrical attachments for surface mounted devices, bus bars on Indium Tin Oxide sputtered surfaces, and anode coatings for tantalum capacitors. This product is designed for use in crossovers with CMI product 116-20, a UV curable dielectric. 114-34A/B119-44 may be blended with 118-09A/B to provide a wide range of conductivity levels for various applications.Features Low temperature curing two component, epoxy ink. Adheres to ITO

117-43 is a waterborne, silver/ silver chloride, based electrically conductive ink and coating suitable for application by screen-printing. This product features adhesion to Kapton, Mylar, glass, and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 117-43 include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, membrane switches, electrical attachments, medical electrodes and static elimination. 117-43 is a screen-printable version of 117-42, for use in facilities where V.O.C's are a concern.Features Water-borne electrode ink

117-43(EU) is a waterborne, silver/ silver chloride, based electrically conductive ink and coating suitable for application by screen-printing. This product features adhesion to Kapton, Mylar, glass, and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 117-43(EU) include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, membrane switches, electrical attachments, medical electrodes and static elimination. 117-43(EU) is an N-methyl Pyrrolidone free version of 117-43, for use in facilities where V.O.C's are a concern.Features Water-borne electrode ink, NMP free.

126-35 is an ink/coating with very high coverage and good electrical conductivity for application by screen-printing, dipping and syringe dispensing. The product features excellent adhesion to Mylar, glass and a variety of other substrates. The proper use of this ink can result in a significant cost saving. Unlike conventional conductive materials, this product is very resistant to abrasion, scratching, flexing and creasing. Some applications for 126-35 include, but are not limited to, RFID antennae, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, and membrane switches. 126-35 can be blended with 125-15 (0.01 ohm/sq/mil version) or 112- 47 (25,000 ohm/sq/mil version) to obtain a range of conductivities.Features Economical high coverage conductive coating

125-09TS is a radio opaque ink/coating for application by screen printing, dipping and syringe dispensing. The product features excellent adhesion to Kapton, Mylar, glass and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to abrasion, scratching, flexing and creasing. Some applications for 125-09TS include, but are not limited to, manufacturing of medical devices and instruments. 125-09TS is a thermosetting version of 125-09T.Features Very abrasion resistant, thermosetting version of 125-09, ideal for urethane

112-48A is an electrically conductive ink/coating for application by screen-printing, dipping and syringe dispensing. The product features excellent adhesion to Kapton, Mylar, glass and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to abrasion, scratching, flexing and creasing. Some applications for 112–48A include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, and membrane switches. 112-48A is a more flexible version of 112-48.Features Standard membrane switch resistive ink