- Product Type:Adhesive, 2K (2 component) Adhesive, Potting Compound, Encapsulant
- Application Area:Optical Applications, Electronic Components, Optoelectronics Devices, Mirror, Fiber Optic Cables, Medical Applications, Medical Devices
- Compatible Substrates & Surfaces:Metal, Glass, Plastics
- Chemical Family:Epoxy & Epoxy Derivatives
EPOXIBOND™ EB-177 is a low viscosity, high Tg, two part epoxy that can be used for potting, encapsulating, or bonding. It is used highly in the medical, optical, and semiconductor industries.EB-177 has excellent high temperature resistance at 300°C and excellent solvent, chemical, and moisture resistance including gamma rays, autoclave, and ETO. It is an excellent choice for semiconductor applications including capillary under fill or flipchip die attach.