Products in Printed Circuit Boards (PCBs)

AGC Chemicals Americas, Inc. Fluon+™ PFA EA-2000 is a perfluoro resin which has been functionalized to include an adhesive group within the polymer backbone. The perfluoro backbone gives the material excellent electrical characteristics, and heat and chemical resistance, while the adhesive functionality facilitates adhesion to other materials in a one-step process, without the need for surface treatment or a separate adhesive layer. Example materials include glass cloth, polyimide, or various metals. This grade is semi-commercialized and may be available upon request. This material is supplied as pellets and packaged in 25kg plastic bags.

EB-316TC-2 is a two component, thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer, medical or optics.

EC-1012MFR-HT is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

EPOXICAST-1006/EH-24 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. The cured system provides excellent resistance to moisture, most organic solvents and inorganic chemicals.

UXP-052107-1 is a filled, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release.

EC-1006M-4 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.

UC-2521 is a filled, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.

UC-2524 is a filled, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.

EC-1009 is a pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

UC-2356 is a two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows for easy flow and air release and excellent hydrolytic stability. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.

EC-1015 is a low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.

UC-2350 is a two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows for easy flow and air release and excellent hydrolytic stability. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.

EC-1012M/EH-20M is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

127-45 is a die attach adhesive engineered for high reliability performance and high efficiency production. This product is a syringe dispensable, anisotropic conductive, one component, 100% solids epoxy adhesive and features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesion to gold plated substrates and tin/lead solder terminated components, die attach operations, printed circuit board fabrication, advanced material composites, sealing and high performance coatings. 127-45 is an anisotropic conductive version of Electraset™ 620.Features Die attach adhesive

128-38 is a screen-printable, B-Stageable, one-part epoxy coating and laminating adhesive that maintains hermetic properties up to 170°C. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include lid attach adhesives, printed circuit board fabrication, advanced material composites, sealing, and high-performance coatings.Features Hermetic properties B-Stageable Long Screen Life High Tg Hermetic lid attach

127-03 is a screen-printable, B-Stageable, thermally conductive, one part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 127-03 is designed to exhibit minimal flow during bonding. This product has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates. Additional applications include, but are not limited to, die attachment, printed circuit board fabrication, advanced material composites, LED attachment, and heat sink bonding. The chemistry in 127-03 features excellent thermal stability and flexibility in the B-Staged form and is optimal for absorbing stress when bonding mismatched CTE substrates. 127-03 is a thermally conductive, electrically insulating version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance Highly thermally conductive epoxy adhesive B-Stageable

127-04 is a screen-printable, B-Stageable, one part epoxy coating and laminating adhesive. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings.Features B-Stageable laminating adhesive

125-35C is a syringe dispensable, 100 % solids, thermally conductive, electrically insulating, precatalyzed, epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 125-35C is flexible and is able to absorb stress when bonding mismatched CTE substrates. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. This is an electrically insulating, thermally conductive version of 124-08C.Features Highly thermally conductive epoxy adhesive

127-31 is an extremely flexible one-component, syringe dispensable, 100% solids, thermally conductive, electrically insulating soft epoxy adhesive, encapsulant, and potting compound. This system features excellent thermal stability, chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 127-31 features a low durometer and is highly flexible allowing it to absorb stress when bonding mismatched CTE substrates. 127-31 even displays some elastomeric properties. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding.Features Elastomeric Flexible thermally conductive adhesive/potting compound

122-39(SD) is a syringe dispensable, thermally conductive, electrically insulating, one component, 100% solids epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesion to gold plated substrates and tin/lead solder terminated components, die attach and thermal management operations, printed circuit board fabrication, advanced material composites, sealing and high performance coatings. 122-39(SD) is a thermally conductive version of 122- 38(SD).Features Ionically clean die attach adhesive

123-34 is a pad-printable, B-Stageable, one part epoxy coating and adhesive, suitable for application by pad printing, dipping and syringe dispensing. This system has been pre-catalyzed with CMI 119-44 to allow for low temperature cure. This product features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings. 123-34 is a pre-catalyzed version of 122- 48.Features B-Stageable Epoxy Adhesive

126-08 is a screen-printable, B-Stageable, highly thermally conductive, one part epoxy coating and adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing and high performance coatings.Features Extremely high thermally conductive epoxy adhesive

125-31FPC is a syringe dispensable, 100 % solids, thermally conductive, electrically insulating, pre-catalyzed epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 125-31FPC is flexible and is able to absorb stress when bonding mismatched CTE substrates. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. 125-31FPC is a finer particle version of 125-31C.Features Highly thermally conductive epoxy adhesive B-Stageable Low temperature curing

122-38(SD) is a single component, silver filled, syringe dispensable, 100% solid, electrically conductive, epoxy adhesive. 122-38(SD) provides for fine pitch resolution, when syringe dispensed, stencil printed, or screen-printed. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, die attachment, printed circuit board fabrication, advanced material composites, sealing and high performance coatings. 122-38(SD) provides excellent adhesion to gold plated substrates, as well as tin/lead solder terminated components.Features Ionically clean die attach adhesive

128-21C is a jet or syringe dispensable, thermally conductive, electrically insulating, pre-catalyzed epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 128-21C is flexible and can absorb stress when bonding mismatched CTE substrates. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. 128-21C is a version of 125-31C optimized for jet dispensing.Features Low stress thermally highly thermally conductive epoxy adhesive

CGSTAPE - 5958 is a polyester film backing with a silicone adhesive. Designed to perform in difficult masking operations such as the masking of surface during application of durable powder coating. Removes without leaving residue on surface. Precision cut for tear resistance and clean.

CGSTAPE - 5358 is a polyester film backing with a silicone adhesive. Designed to perform in difficult masking operations such as the masking of surface during application of durable powder coating. Removes without leaving residue on surface. Precision cut for tear resistance and clean.

Black Flexible Epoxy, Encapsulating & Potting Compound 832FX is a black, 2-part, flexible epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where minimizing the physical stress on components is critical. It performs well in low temperature and arctic environments, as well as applications that involve temperature cycling or rapid temperature changes. It provides the functionality of silicone, but with the durability and cost-effectiveness of epoxy.

High Temperature Epoxy, Encapsulating & Potting Compound 832HT is a general purpose, rigid, black, 2-part high temperature epoxy that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. It is useful when extreme physical strength and chemical resistance are required. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

The 403A Super Cold™ 134 is a pure, non-flammable cold spray that is used primarily for diagnosing thermally intermittent problems with electronic devices. The cold spray contains pure 1,1,1,2-tetrafluoroethane (HFC 134a).

Black 1:1 Epoxy, Encapsulating & Potting Compound 832HD is a black, rigid, 2-part epoxy that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Due to its low mixed viscosity, 832HD can easily penetrate small gaps and cavities. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

Translucent Epoxy, Encapsulating & Potting Compound 832C is a rigid, amber clear epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Due to its low mixed viscosity, it can easily penetrate small gaps and cavities. It also provides excellent electrical insulation and protects components from static discharges, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

Thermally Conductive Epoxy, Encapsulating & Potting Compound 832TC is a 2-part, black epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. It is designed for applications where thermal management is a concern. Its high thermal conductivity helps protect circuits by reducing the risk of heat buildup. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

Black Flexible Epoxy, Encapsulating & Potting Compound 834FX is a 2-part, flame-retardant, thermally conductive, fexible epoxy resin that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where minimizing the physical stress on components is critical. It is good in low temperature and arctic environments, and in applications that involve temperature cycling or rapid temperature changes. It provides the functionality of silicone, but with the durability and cost-effectiveness of epoxy.

High Thermal Conductivity Epoxy, Encapsulating & Potting Compound 834HTC is a 2-part, black, rigid, flameretardant thermal epoxy that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This epoxy resin is designed for applications where thermal management and selfextinguishing are critical. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

403C Super Cold™ HFO-1234ZE is a non-flammable cold spray that is used primarily for diagnosing thermally intermittent problems with electronic devices. It is also useful for protecting heat sensitive components during soldering, quickly cooling solder joints, and it can also be used to quickly remove gum and other adhesives from a variety of surfaces.