Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
Features & Benefits
- Specific Features
Heat curing Silicone rubber adhesive.
Applications & Uses
- Application Area
- Compatible Substrates & Surfaces
- Cure Method
- Applications
Insulators
- Processing
- Before applying the adhesive the surfaces of the substrate should be cleaned with a non-polar solvent, e.g. chemically pure acetone or white spirit.
- After thorough mixing of component A with 1% of component B the mixture should be applied in a thin layer.
- The parts should be fixed with low pressure to avoid squeezing out the adhesive. Curing of the adhesive takes place at 130°C.
- The curing process of the adhesive is finished after approx. 30 seconds at 130°C.
- Cycle time is mainly depending on the heat transfer and volume of the substrate.
- Adhesion can be further improved by post curing, e.g. at 200°C for 4h.
Properties
- Cured Properties
- Uncured Properties
- Note
Cure conditions: 10 min / 165°C.
| Value | Units | Test Method / Conditions | |
| Density | 1.15 | g/cm³ | DIN EN ISO 1183-1 A |
| Elongation (at break) | 350 | % | ISO 37 Type 1 |
| Shore Hardness A | 67 | — | DIN ISO 48-4 |
| Tear Strength | 22 | N/mm | ASTM D 624 B |
| Tensile Strength | 9 | N/mm² | ISO 37 Type 1 |
| Value | Units | Test Method / Conditions | |
| Dynamic Viscosity (Component A, Shear rate 10 s⁻¹) | 4500000 | — | DIN EN ISO 3219 |
| Dynamic Viscosity (Component B, Shear rate 10 s⁻¹) | 22000 | — | DIN EN ISO 3219 |
| Kick-Off Temperature | 120 | °C | — |
| Mix Ratio (A:B) | 100:1 | parts by weight | — |
| Pot Life (at 23°C) | min. 3 | hours | — |
Packaging & Availability
- Country Availability
- Regional Availability