Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Technologies
Features & Benefits
Applications & Uses
- Markets
- Cure Method
- Applications
- General-purpose adhesive for the electronics industry
- FIPG and CIPG applications
- Power semiconductor insulation coating
Processing
Surface Preparation
All surfaces must be clean and free of contaminants that will inhibit the cure of SEMICOSIL® 988 TIC. Examples of inhibiting contaminants are sulfur containing materials, plasticizers, urethanes, amine containing materials and organometallic compounds - especially organotin compounds. If a substrate’s ability to inhibit cure is unknown, a small scale test should be run to determine compatibility.
Dispensing
Because of the high thixotropy (shear thinning effect) SEMICOSIL® 988 TIC can be dispensed easily with all dispensing equipments.
Curing
SEMICOSIL® 988 TIC works best when cured at 125 °C or more, depending on the size and heat sink properties of the components. SEMICOSIL® 988 TIC shows good primerless adhesion to many substrates. We recommend running preliminary tests to optimize conditions for the particular application.
Temperature Curing time, thickness 5 mm
125 °C 3 h 150 °C 1 h 180 °C 20 min
Properties
- Color
- Cured Properties
- Uncured Properties
- Properties
- Ready-to-use, one-part system
- Thixotropic
- Transparent
- Medium hardness
- High flexibility (low-stress adhesive)
- Rapid heat cure
- Excellent primerless adhesion on many substrates
- Excellent insulation properties
- Low ion content
- Note
Cured properties are cured for 30 min. at 150°C.
| Value | Units | Test Method / Conditions | |
| Density (at 23°C) | 1.1 | g/cm³ | DIN EN ISO 1183-1 A |
| Dielectric Strength | 23 | kV/mm | IEC 60243-1 |
| Elongation (at break) | 350 | % | ISO 37 Type 1 |
| Modulus (at 100 % elongation) | 0.5 | N/mm² | ISO 37 |
| Shore Hardness A | 36 | — | DIN ISO 48-4 |
| Tear Strength | min. 20 | N/mm | ASTM D 624 B |
| Tensile Strength | min. 3 | N/mm² | ISO 37 Type 1 |
| Tracking Resistance | min. 600 CTI | — | IEC 60587 |
| Volume Resistivity | 10¹⁵ | Ohm-cm | IEC 62631-3-1 |
| Value | Units | Test Method / Conditions | |
| Density (at 23°C) | 1.1 | g/cm³ | DIN EN ISO 1183-1 A |
| Dynamic Viscosity (at 25°C, Shear rate 0.5 s⁻¹) | 480000 | mPa·s | ISO 3219 |
| Dynamic Viscosity (at 25°C, Shear rate 25 s⁻¹) | 37000 | mPa·s | ISO 3219 |
Regulatory & Compliance
- Certifications & Compliance
Safety & Health
- Safety Note
According to the latest findings, addition-curing RTV-2 silicone rubber SEMICOSIL® 988 TIC contains neither toxic nor aggressive substances that require special handling precautions. General industrial hygiene regulations should be observed.
Packaging & Availability
- Country Availability
- Regional Availability
Storage & Handling
- Storage Information
SEMICOSIL® 988 TIC should be stored between 5 °C and 25 °C in the tightly closed original container.