Knowde Enhanced TDS
Identification & Functionality
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Features & Benefits
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Applications & Uses
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- Cure Method
- Application Details
Because of the thixotropic behavior, SEMICOSIL® 924 is specially recommended for local encapsulation of delicate electronic components, e.g. bonded chips on hybrid components which are exposed to extreme external influences.
Processing
Surface preparation
All surfaces must be clean and free of contaminants that will inhibit the cure of SEMICOSIL® 924. Examples of inhibiting contaminants are sulfur containing materials, plasticizers, urethanes, amine containing materials and organometallic compounds – especially organotin compounds. If a substrate’s ability to inhibit cure is unknown, a small scale test should be run to determine compatibility.
Dispensing
Because of the thixotropy (shear thinning effect) SEMICOSIL 924 can be dispensed easily with all dispensing equipments. To eliminate any air introduced during dispensing or trapped under components or devices a vacuum encapsulation is recommended.
Curing
- SEMICOSIL® 924 works best when cured at 100 °C or more depending on the size and heat sink properties of the components. The reactivity can be adjusted within wide limits by adding Catalyst EP or Inhibitor PT 88 to suit the processing requirements of the particular application.
- Catalyst EP increases the reactivity, i. e., pot life and curing time are reduced. Inhibitor PT 88 is a pot life extender and prolongs pot life and curing time.
Temperature Curing time, thickness 1 cm
100 °C 240 min 130 °C 40 min 150 °C 10 min
Properties
- Physical Form
- Cured Properties
- Uncured Properties
- Properties
- One-part, ready-to-use
- Thixotropic flow
- Forms a soft gel on vulcanization
- Low content of volatiles
- Low content of uncured polymer
- Low ion content
- Almost constant properties between –50 °C and +180 °C
- Note
Cured properties are cured for 30 min at 150 °C in a circulating air oven.
| Value | Units | Test Method / Conditions | |
| Density (at 23°C) | 0.98 | g/cm³ | DIN EN ISO 1183-1 A |
| Extractable Ion Content (Na, K, Li, Cl, at 121°C, 48 hours) | 5 | ppm | — |
| Hardness Penetration (quarter cone, 9.38 g) | 5 | mm | — |
| Value | Units | Test Method / Conditions | |
| Density (at 20°C) | approx. 0.97 | g/cm³ | DIN 51757 |
| Dynamic Viscosity (at 23°C, Shear rate 0.5 s⁻¹) | 35000 | mPa·s | ISO 3219 |
| Dynamic Viscosity (at 23°C, Shear rate 100 s⁻¹) | 2000 | mPa·s | ISO 3219 |
Regulatory & Compliance
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Safety & Health
- Safety Note
According to the latest findings, the addition-curing silicone rubber SEMICOSIL® 924 contains neither toxic or corrosive substances which would require special handling precautions.
Packaging & Availability
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