Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
Features & Benefits
- Ready-to-Use Product Features
Applications & Uses
- Markets
- Applications
- Application Area
- Application Method
- Applications
- Automotive Electronics
- Connector Encapsulation
- Electrics & Electronics
- Electronic Control Unit (ECU)
- Encapsulation
- Power Control Unit (PCU)
- Power Electronics
- UV active encapsulant
- Sealing of connectors (injection-molded thermoplastics + pins)
- Allows short cycle times by fast solidification of silicone
- Application Details
- Surface Preparation
- All surfaces must be clean and free of contaminants that will inhibit the cure of SEMICOSIL® 949 UV A/B. Examples of inhibiting contaminants are sulfur containing materials, plasticizers, urethanes, amine containing materials and organometallic compounds – especially organotin compounds.
- If a substrate’s ability to inhibit cure is unknown, a small scale test should be run to determine compatibility.
- Handling
- The A-component contains an UV-tracer that is dispersed in the silicone. The UV-tracer may be subject to a limited sedimentation. In order to guarantee homogenous product performance (curing time, UV-tracability) it is recommended to homogenize the A-side prior to application by stirring.
- The A-component contains an UV-tracer that is dispersed in the silicone. The UV-tracer may be subject to a limited sedimentation. In order to guarantee homogenous product performance (curing time, UV-tracability) it is recommended to homogenize the A-side prior to application by stirring.
- Mixing
- Component B of SEMICOSIL® 949 UV A/B contains the platinum catalyst, component A the crosslinker. Even traces of the platinum catalyst may cause gelling of the component containing the crosslinker. Therefore tools (spatula, stirrers, etc.) used for handling the platinum-containing component or the catalyzed compound must not come into contact with this
- component.
- The two components should be thoroughly mixed at a 10 : 1 ratio by weight or volume.
- To eliminate any air introduced during dispensing or trapped under components or devices a vacuum encapsulation is recommended.
- Curing
- For the curing an UV lamp (Fe-lamp, D-bulb) with an emission between 250 and 350 nm can be used. It is recommended not to use lamp systems that emit light with a wavelength below 250 nm.
- Curing time of SEMICOSIL® 949 UV A/B is highly dependent on UVactivation.
- Significant differences in curing time are obtained for curing different layer thicknesses and for using different substrate materials. Typical values are given below.
- UV-activation Time (sec) Curing time (140 mW/cm²) at 25°C (2mm)
- 5 sec 2 min
- 10 sec 1 min
- 20 sec 40 sec
- Use of UV-LEDs
- A cure with UV-LEDs is basically possible, however only under certain specific conditions:
- 365 nm emssion
- High-Power UV-LED
- Minimization of distance Silicone surface to LED
- Layer thickness < 5 mm (depth of light penetration smaller compared to cure with discharge lamps)
- Matching of area to be irradiated to UV-LED emission array
-
UV-activation
(140 mW/cm²)Curing time
at 25°C(2 mm)5 s 2 min 10 s 1 min 20 s cured after 40 s UV
- Surface Preparation
Properties
- Catalyst Properties
- Cured Properties
- Uncured Properties
- Properties
- Two-part, 10 : 1 mixing ratio
- Low viscosity
- Extremely fast curing at room temperature (after uv-activation)
- Low hardness (shore 00)
- Offers process control option by uv-light (contains uv-tracer)
| Value | Units | Test Method / Conditions | |
| Dynamic Viscosity (at 25°C) | 200 | mPa·s | DIN EN ISO 3219 |
| Mix Ratio | 10:1 | parts by weight | — |
| Pot Life (at 23°C) | min. 1 | day | — |
| Value | Units | Test Method / Conditions | |
| Density (at 23.0°C) | 0.97 | g/cm³ | DIN EN ISO 1183-1 A |
| Shore Hardness 00 (at 23°C) | 40 | — | ASTM D 2240 |
| Value | Units | Test Method / Conditions | |
| Density (at 23°C, Componenet A) | 0.97 | g/cm³ | DIN EN ISO 2811-2 |
| Density (at 23°C, Componenet B) | 0.97 | g/cm³ | DIN EN ISO 2811-2 |
| Dynamic Viscosity (Component A, at 25°C) | 150 | mPa·s | DIN EN ISO 3219 |
| Dynamic Viscosity (Component B, at 25°C) | 1000 | mPa·s | DIN EN ISO 3219 |
| Platinum Catalyst in Component (UV active organometallic catalyst) | Component A | — | — |
| Platinum Catalyst in Component (UV active organometallic catalyst) | Component B | — | — |
Regulatory & Compliance
- Certifications & Compliance
Packaging & Availability
- Country Availability
- Regional Availability