Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
Features & Benefits
- Ready-to-Use Product Features
Applications & Uses
- Applications
- Application Area
- Applications
- Antifriction Agents & Lubricants
- Encapsulation
- Application Details
- WACKER® PASTE P 12 is used especially in semiconductor technology as a heat sink paste. Wherever it is important to have good heat transfer from a semiconductor to a cooling element, it is advisable to apply a thin coating of WACKER® PASTE P 12. In the assembly of semiconductors, e. g. diodes, transistors and thyristors, microscopic irregularities may exist on the mating surfaces of the semiconductor and the cooling surface. When assembled, a firm metal-to-metal contact might be hampered by these surface irregularities. A significant percentage of the device's surface therefore might lack direct contact to the heatsink. Remaining gaps are filled with air, providing relatively poor thermal conductivity.
- By coating the contact surfaces with WACKER® PASTE P 12, surface irregularities will be filled with the heat sink silicone paste. The thermal conductivity of WACKER® PASTE P 12 is about 20 times better than that of air. Practical experience has shown that by using WACKER® PASTE P 12, the heat transfer resistance from the semiconductor housing to the cooling elements is reduced by 50 %.
Processing
The product can be applied with a brush, spatula or by screen printing. Best results are achieved when a uniform, thin coating is applied to the mating surfaces. Excess paste that's squeezed during assembly should be removed.
Properties
- Color
- Physical Form
- Typical Properties
- Properties
Thermally conductive
| Value | Units | Test Method / Conditions | |
| Bleeding (at 30hours, 200°C) | max. 0.4 | % | FED-STD 791 M 321 |
| Density (at 23°C) | 2.1 | g/cm³ | DIN EN ISO 1183-1 A |
| Dielectric Strength | 10 | kV/mm | IEC 60243-1 |
| Dissipation Factor (tan δ, at 50Hz) | 9 x 10⁻³ | — | IEC 62631-2-1 |
| Loss of Weight (at 200°C, 30 hours) | max. 1.2 | % | FED-STD 791 M 321 |
| Operating Temperature | -40 to - 200 | °C | — |
| Penetration (unworked, measured after 24hours dwell time; 150g cone, 5s penetration time) | 19.4 - 23.8 | mm | DIN ISO 2137 |
| Permittivity (at 50Hz) | 3.5 | — | IEC 62631-2-1 |
| Solidification Point | approx. -45 | °C | — |
| Thermal Conductivity | 0.6 - 0.8 | W/m.K | ASTM D 5470-12 |
Regulatory & Compliance
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Packaging & Availability
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Storage & Handling
- Storage Information
Store in a dry and cool place.